Papers:
Accurate Modeling for RF Silicon MOSFET up to 15 GHz and the Parameter Extraction Methodology
The accurate method to extract a small-signal subcircuit model of MOSFET’s based on BSIM4 is presented, a novel approach to determining the parasitic inductances by Z-parameters, the intrinsic terminal resistance and capacitance by Y-parameters are [...]
Ultra Thin Packaging of the RF-MEMS Devices with Low loss
Park H-W., Park Y.K., Kim C.J., Kim H., Kim Y.K., Kim C.J., Kim H., Kim Y.K., Lee D.J., Park H-W., Park Y.K., Kim C.J., Kim H., Kim Y.K., Ju B.K., Korea Institute of Science and Technology, KR
RF-MEMS devices have the potential for providing an overarching circuit integration technology that can significantly reduce the size, weight and cost. In this research, as ultra thin silicon substrate which has thickness of 50um was [...]
RF-MEMS Voltage Tunable Capacitor using Electrostatic Forces
In this paper, we have proposed a fabrication method of a RF-MEMS voltage tunable capacitor using Au-electroplating technique, which has one movable parallel plate with various structure of beams. We applied an electrostatic method and [...]
Design Optimization of Micromachined High Aspect Ratio 3D On-Chip Solenoid Inductor
We report the simulation work done by using Sonnet EMÔ on high aspect ratio (1:4 and 1:8) 3D on-chip air-core solenoid inductors. Simulations on 2, 3, and 5-turn inductors with 200 and 400 mm high [...]
Numerical Simulations of Novel Constant-Charge Biasing Method for Capacitive RF MEMS Switch
In the capacitive RF MEMS SW, it has been shown that every 5V of increased actuation voltage decreases the lifetime by an order of magnitude. In this paper, a novel method for automatically controlling the [...]
Fabrication of 3-Dimesional Cu Coaxial Cylinder using Porous Silicon MEMS Technology
Therefore, this paper reports 3-dimensional Cu coaxial cylinder with a thick OPS(oxidized porous silicon) in low resistivity silicon for application of microwave and RF integrated circuit technology. A novel on-chip 3D coaxial cylinder was fabricated [...]
MEMS Technologies for Communications
Micromechanical (or umechanical) communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible MEMS-based receiver front-end architectures are [...]
Journal: TechConnect Briefs
Volume: 2, Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 2
Published: February 23, 2003
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9728422-1-7