Papers:
Application of Dual-Phase-Lag Model for Thermal Analyses of Electronic Nanostructures
This paper presents the Dual-Phase-Lag (DPL) equation as a possible candidate to model heat transfer processes in electronic nanostructures. The analyses presented in this paper are carried out for a thin one-dimensional slab heated on [...]
Novel Nanoeletromechanical Switches for VLSI Power Integrity Improvement
Complementary Metal Oxide Semiconductor(CMOS)is facing extreme difficulties to realize energy efficient designs while the scaling of channel length has been being at the same pace in the past several decades.In this paper,we presented a novel [...]
Modeling the effect of the increase in the actuation voltage on the dynamic behavior of a RF MEMS switch
Abstract—In the past few years many reports have demonstrated the development of RF-MEMS switches considering the mechanical, electrical and chemical behaviors separately. However there are a few works which address the whole aspects of RF-MEMS [...]
The Heat transfer in Fin-FET transistor
The electro-thermal analysis is one of the most important development steps in the professional design of analogue submicron electric ICs, power modules design process as well as modern nanostructures. This analysis is useful to power [...]
Threshold Voltage Model of Hetero Gate Dielectric-Dual Material Gate-GAA-Tunnel FET
In this paper, a hetero gate dielectric, dual material gate, gate all around tunnel field effect transistor (HD-DMG-GAA-TFET) has been proposed. An analytical model for the same has been developed to examine the band to [...]
High-voltage Edge-rounded Adjustable Trapezoidal Waveform Generators
An approach to design low-voltage and high-voltage trapezoidal waveform generators with edge-rounding ability is described. The paper presents circuits able to produce edge-rounded trapezoidal waveforms, endowed with several means of waveform parameter adjustments. Signal paths [...]
Time-Domain Monte-Carlo and Noise Analysis of MAPS Sensors
A non-typical approach to extended simulational analysis for monolithic active pixel (MAPS) based binary pixel readout circuits is presented. Circuit solutions and simulation results are presented and discussed. Applications of particle detection/tracking are quite wide, [...]
Simulation of High-k Passivation-Layer Effects on Breakdown Voltage in AlGaN/GaN HEMTs
A two-dimensional analysis of breakdown characteristics in AlGaN/GaN high-electron-mobility transistors (HEMTs) is performed by considering a deep donor and a deep acceptor in a buffer layer. The dependence of an off-state breakdown voltage on the [...]
Simulation of Current Slump Removal in Field-Plate GaAs MESFETs
Two-dimensional transient analysis of field-plate GaAs MESFETs is performed by considering surface states in the region from the gate toward the drain. Quasi-pulsed current-voltage curves are derived from the transient characteristics. It is shown that [...]
Simulation of Lags and Current Collapse in Field-Plate AlGaN/GaN HEMTs with Deep Acceptors in a Buffer Layer
Two-dimensional transient analysis of field-plate AlGaN/GaN HEMTs is performed in which a deep acceptor is considered in a semi-insulating buffer layer, and quasi-pulsed current-voltage curves are derived from them. It is studied how the existence [...]
Simulation of Phonon Thermalization in a Single-photon Detector on the Basis of CeB6 Thermoelectric Sensor
Kuzanyan A.A., Kuzanyan V.R. Nikoghosyan A.S., Kuzanyan A.A., Kuzanyan V.R. Nikoghosyan A.S., Institute for Physical Research, Armenian Academy of Science, AM
Interest in single-photon detectors (SPD) has recently increased dramatically, due to many novel applications. The most developed SPD are currently based on superconductors. Following the theory, thermoelectric detectors (TSPS) can compete with superconducting detectors. The [...]
Evaluation of Garofalo creep model for lead-free solder joints in surface mount components
This investigation employs four hyperbolic sine creep constitutive models to simulate the deformation in Sn[3.0-4.0%]Ag[0.5-1.0%]Cu solder joints of two surface mount components assembled on printed circuit board. These creep models are proposed by Schubert et [...]
Effect of IMC thickness on thermo-mechanical reliability of lead-free solder joints in solar cell assembly
The fatigue failure of lead-free SnAgCu solder joints in solar cell assembly is studied to determine the effect of thickness of intermetallic compound (IMC) layer on the reliability of the joints. Finite element modelling (FEM) [...]
Journal: TechConnect Briefs
Volume: 4, Advanced Manufacturing, Electronics and Microsystems: TechConnect Briefs 2015
Published: June 14, 2015
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topic: Informatics, Modeling & Simulation
ISBN: 978-1-4987-4730-1