Wafer and MEMS Processing – TechConnect Briefs

Fabrication of 3D MEMS Antenna Array for Infrared Detector Using Novel UV-Lithography Apparatus, Plastic Micro Machining and Micro Assembly Technique

Park J.Y., Kim K.T., Moon S., Pak J.J., Korea Institute of Science and Technology, KR

This paper describes the novel UV-Lithography technique for fabrication of 3D feed horn mold structure array using implementation of mirror reflected parallel beam illuminator(MRPBI) system, fabrication of 3D feed horn MEMS antennas plate using plastic [...]

Fabrication of High Quality PZT Thick Film Using Lift-Off Technique

Zhao H.J., Ren T.L., Liu J.S., Liu L.T., Liu J.S., Liu L.T., Li Z.J., Liu J.S., Liu L.T., Institute of Microelectronics, Tsinghua University, CN

Lead-zirconate-titanate (PZT) is a typical ferroelectrical material with outstanding properties. The demand for the thickness of PZT films used in MEMS is usually over 1_m due to the advantages of the thick thin films, so [...]

A New, Topology Driven Method for Automatic Mask Generation from Three-Dimensional Models

Schiek R., Schmidt R., Sandia National Laboratories, US

We have developed an algorithm which when given a three-dimensional object can infer from the objects topology the two-dimensional masks needed to produce that object with surface micromachining.Our algorithm, called Faethm, calculates the required two-dimensional [...]

Modeling and Simulation of Micromachined Needles

Zhang P., Jullien G.A., University of Calgary, CA

The research and development of microneedles are reviewed briefly and microneedles are classified. The features of those microneedles are analyzed and discussed. Based on those analysis, a new microneedle structure has been proposed. Those microneedles [...]

A Study on the Fabrication of Micro Structure using Chemical Mechanical Micro Machining Process

Park J.M., Lee H.W., Jeong H.D., Pusan National University, KR

Single crystal silicon is widely used in the microelectronic industry. Recent advances in ultra precision machining have enabled the possibility of direct diamond turning of high quality surfaces on the brittle materials. As a brittle [...]

Introduction of Micro-Manipulation by Adhesional Force and Dielectric Force

Takahashi K., An Y., Saito S., OnzawaTadao T., Tokyo Institute of Technology, JP

This paper reports the manipulation by both adhesional force and Coulomb force. Applicability of this method is discussed evaluating both of the forces theoretically and experimentally. Adhesional force can be used as attractive force in [...]

A Fluoro-ethoxysilane-Based Stiction-Free Release Process for Submicron Gap MEMS

Parvais B., Pallandre A., Jonas A.M., Raskin J-P, Université catholique de Louvain, BE

Nowadays, stiction remains one of the biggest reliability problems in the fabrication of micro-electromechanical systems (MEMS), especially when a small gap is used. To avoid the adhesion, a Self-Assembled Monolayer (SAM) can be coated. Main [...]

Parallel Plate Plasma Etching for MEMS Processing-Reactor Modelling

Babarada F., Dunare C., Profirescu M., University Politehnica Bucharest, RO

The model presented analyses the uniformity of dry etching polyslicon films which are used in resonator cavity for MEMS fabrication/1,2/. The increase of the uniformity is very important for nanotechnology and very strong required of [...]

Wafer-Level High Density Multifunctional Integration (HDMI) for Low-Cost Micro/Nano/Electro-Opto/Bio Heterogeneous Systems

Gutmann R.J., Lu J-Q, McMahon J.J., Persans P.D., Cale T.S., Eisenbraun E.T., Castracane J., Kaloyeros A.E, Rensselaer Polytechnic Institute, US

A technology platform -wafer-scale high density multifunctional integration (HDMI) -is described which offers the potential for low-cost integration of information processing and sensor/actuator technologies for future microelectronic, nanoelectronic, mixed electro-optical and bio-molecular systems. The HDMI [...]

Nanomachining on Si (100) Surfaces Using an Atomic Force Microscope with Lateral Force Transducer

Ichida Y., Morimoto Y., Sato R., Murakami M., Utsunomiya University, JP

In recent years, the surface modification with an atomic force microscope (AFM) has attracted special interest as one of the surface processing techniques in a nanometer scale [1-3]. Particularly, this technique will play an increasingly [...]

Local Oxidation Characteristics of Single Crystal Silicon

Ichida Y., Morimoto Y., Sato R., Saito N., Utsunomiya University, JP

Recently, the surface modification with an atomic force microscope (AFM) has attracted special interest as one of the surface processing techniques in a nanometer scale and investigated vigorously [1]. The nanometer-scale scratching (nanoscratching) that removes [...]

A Novel Method of Stereolithographic Alignment for MEMS Structures

Choudhury A., Hesketh P.J., Georgia Institute of Technology, US

In recent years there has been a fair amount of interest in integration of stereolithography with MEMS devices for purposes of packaging of microfluidic devices or to build new MEMS devices that are able to [...]

Process for Extremely Thin Silicon-on-Insulator Wafer

Usenko A.Y., Carr W.N., Chen B., Silicon Wafer Technologies, Inc., US

We observe hydrogen platelets buildup into single crystalline silicon caused by hydrogen plasma processing. The platelets are aligned along a layer of lattice defects formed in silicon before plasma processing. The buried defect layer is [...]

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