This paper presents a novel Adaptive Single-Mode (ASM) Pull-In extraction scheme for CAD of electrostatic MEMS. The scheme is 50 to 1000 times faster than various previously suggested methods. The extracted Pull-In parameters are shown [...]
, Kim, J.G.
, Kim, J.H.
, Kim, Y.H.
, Lee, H.Y.
, Seoul National University, KR
Surface micro-machined MEMS frequently suffer from the residual stress which might significantly decrease the performance and reliability of micro devices. It is important to accurately measure the residual stresses at manufacturing step. The Stoney’s equation [...]
, Craighead, H.
, Feygelson, T.
, Nguyen, C.T.-C.
, Sekaric, L.
, Wang, J.
, Naval Research Laboratory, US
Diamond materials offer great potential for many MEMS and NES applications. Amongst the attractive technological properties of diamond materials are the high stiffness, thermal conductivity, optical transparency range, chemical stability and erosion resistance, and dopant [...]
The high Q-factor and stability of micromechanical resonators makes them attractive for a range of applications such as R.F. filters  and resonant sensors . In many cases, a specific resonant frequency is necessary for [...]
Self-assembly of three-dimensional microstructures has been achieved using EPDA (Electrothermal Plastic Deformation Assembly). The EPDA process, in this case, is dependent on gold yielding within a gold and polysilicon bimorph. To plastically deform the bimorph [...]
MEMs microbeams consist of many thin material layers. This thin layered structure is very similar to that of laminated composite plates in which thin layers of fiber reinforced plastic are stacked and cured. Both the [...]
The reliability of MEMS devices greatly depends on precise characterization of material behavior at the micron scale. This paper presents a novel material characterization device for fatigue testing. The fatigue specimen is subjected to multi-axial [...]
Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 1
Published: February 23, 2003
Industry sector: Sensors, MEMS, Electronics
Topics: Modeling & Simulation of Microsystems