Papers – Page 21 – TechConnect Briefs

Microplate Modeling under Coupled Structural-Fluidic-Electrostatic Forces

Younis M.I., Nayfeh A.H., Virginia Tech, US

We present a model for the dynamic behavior of microplates under the coupled effects of squeeze-film damping, electrostatic actuation, and mechanical forces. The model simulates the dynamics of microplates and predicts their quality factors under [...]

Dynamic Simulation of an Electrostatically Actuated Impact Microactuator

Zhao X., Dankowicz H., Reddy C.K., Nayfeh A.H., Virginia Tech, US

We study the dynamics of an electrostatically driven impact microactuator reported by Mita and associates. The microactuator is modeled as a two-degree-of-freedom rigid multibody system. The impact phenomenon is described by a simple impact law [...]

Compact Models for Squeeze-Film Damping in the Slip Flow Regime

Sattler R., Wachutka G., Technical Univeristy of Münich, DE

We propose a mixed-level simulation scheme for squeeze film damping effects in microdevices, which makes it possible to include damping effects in system-level models of entire microsystems in a natural, physically-based and flexible way. Our [...]

Feature Length-Scale Modeling of LPCVD and PECVD MEMS Fabrication Processes

Musson L.C., Ho P., Plimpton S.J., Schmidt R.C., Sandia National Laboratories, US

The surface micromachining processes used to manufacture MEMS devices and integrated circuits transpire at such small length scales and are sufficiently complex that theoretical analysis of them is particularly inviting. Under development at Sandia National [...]

Extending the Validity of Existing Squeezed-Film Damper Models with Elongations of Surface Dimensions

Veijola T., Pursula A., Helsinki University of Technology, FI

Border flow effects in squeezed-film dampers having a gap separation comparable with the surface dimensions are studied with 2D and 3D FEM simulations and with analytic models derived from the linearized Reynolds equation for small [...]

Circuit Modeling and Simulation of Integrated Microfluidic Systems

Chatterjee A.N., Aluru N.R., Beckman Institute, US

A combined circuit-device model for the analysis of integrated microfluidic system is presented. The complete model of an integrated microfluidic device incorporates modeling of the fluidic transport, chemical reaction, reagent mixing and separation. The microfluidic [...]

Three-Dimensional CFD-Simulation of a Thermal Bubble Jet Printhead

Lindemann T., Sassano D., Bellone A., Zengerle R., Koltay P., University of Freiburg, DE

This paper reports on a three-dimensional simulation of a commercial, thermally actuated bubble jet printhead using an appropriate pressure boundary condition for the bubble nucleation and expansion. The ink jet system has been used as [...]

Electromechanical Buckling of a Pre-Stressed Layer Bonded to an Elastic Foundation

Abu-Salih S., Elata D., Technion – Israel Institute of Technology, IL

The electromechanical buckling of a pre-stressed layer bonded to an elastic foundation is analyzed. A new analytic solution of the mechanical post-buckling is presented. In addition, it is shown that electrostatic forces can precipitately instigate [...]

Contact Force Models, including Electric Contact Deformation, for Electrostatically Actuated, Cantilever-Style, RF MEMS Switches

Coutu_Jr. R.A., Kladitis P.E., Air Force Institute of Technology, US

Electrostatically actuated, cantilever-style, metal contact, radio frequency (RF), microelectromechanical systems (MEMS) switches depend on having adequate contact force to achieve desired, low contact resistance. In this study, contact force equations that account for beam tip [...]

Free Surface Flow and Acousto-Elastic Interaction in Piezo Inkjet

Wijshoff H., Océ Technologies B.V., NL

Modeling plays an essential role in our research on new inkjet technologies. Structural modeling with Ansys includes piezo-electricity. Acoustic modeling in Ansys and Matlab involves fluid-structure interaction. CFD modeling with Flow3D includes wall-flexibility and free [...]