Microplate Modeling under Coupled Structural-Fluidic-Electrostatic Forces

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We present a model for the dynamic behavior of microplates under the coupled effects of squeeze-film damping, electrostatic actuation, and mechanical forces. The model simulates the dynamics of microplates and predicts their quality factors under a wide range of gas pressures and applied electrostatic forces up to the pull-in instability. The model utilizes the nonlinear Euler-Bernoulli beam equation, the linearized dynamic von-Karman plate equations, and the linearized compressible Reynolds equation. The static deflection of the microplate is calculated using the beam model. Perturbation techniques are used to derive analytical expressions for the pressure distribution in terms of the plate mode shapes around the deflected position. The static deflection and the analytical expressions are substituted into the plate equations, which are solved using a finite-element method.

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Journal: TechConnect Briefs
Volume: 2, Technical Proceedings of the 2004 NSTI Nanotechnology Conference and Trade Show, Volume 2
Published: March 7, 2004
Pages: 251 - 254
Industry sector: Sensors, MEMS, Electronics
Topics: MEMS & NEMS Devices, Modeling & Applications
ISBN: 0-9728422-8-4