Nanoelectronics – Page 78 – TechConnect Briefs

A Fluoro-ethoxysilane-Based Stiction-Free Release Process for Submicron Gap MEMS

Parvais B., Pallandre A., Jonas A.M., Raskin J-P, Université catholique de Louvain, BE

Nowadays, stiction remains one of the biggest reliability problems in the fabrication of micro-electromechanical systems (MEMS), especially when a small gap is used. To avoid the adhesion, a Self-Assembled Monolayer (SAM) can be coated. Main [...]

Introduction of Micro-Manipulation by Adhesional Force and Dielectric Force

Takahashi K., An Y., Saito S., OnzawaTadao T., Tokyo Institute of Technology, JP

This paper reports the manipulation by both adhesional force and Coulomb force. Applicability of this method is discussed evaluating both of the forces theoretically and experimentally. Adhesional force can be used as attractive force in [...]

A Study on the Fabrication of Micro Structure using Chemical Mechanical Micro Machining Process

Park J.M., Lee H.W., Jeong H.D., Pusan National University, KR

Single crystal silicon is widely used in the microelectronic industry. Recent advances in ultra precision machining have enabled the possibility of direct diamond turning of high quality surfaces on the brittle materials. As a brittle [...]

Modeling and Simulation of Micromachined Needles

Zhang P., Jullien G.A., University of Calgary, CA

The research and development of microneedles are reviewed briefly and microneedles are classified. The features of those microneedles are analyzed and discussed. Based on those analysis, a new microneedle structure has been proposed. Those microneedles [...]

A New, Topology Driven Method for Automatic Mask Generation from Three-Dimensional Models

Schiek R., Schmidt R., Sandia National Laboratories, US

We have developed an algorithm which when given a three-dimensional object can infer from the objects topology the two-dimensional masks needed to produce that object with surface micromachining.Our algorithm, called Faethm, calculates the required two-dimensional [...]

Fabrication of High Quality PZT Thick Film Using Lift-Off Technique

Zhao H.J., Ren T.L., Liu J.S., Liu L.T., Liu J.S., Liu L.T., Li Z.J., Liu J.S., Liu L.T., Institute of Microelectronics, Tsinghua University, CN

Lead-zirconate-titanate (PZT) is a typical ferroelectrical material with outstanding properties. The demand for the thickness of PZT films used in MEMS is usually over 1_m due to the advantages of the thick thin films, so [...]

Fabrication of 3D MEMS Antenna Array for Infrared Detector Using Novel UV-Lithography Apparatus, Plastic Micro Machining and Micro Assembly Technique

Park J.Y., Kim K.T., Moon S., Pak J.J., Korea Institute of Science and Technology, KR

This paper describes the novel UV-Lithography technique for fabrication of 3D feed horn mold structure array using implementation of mirror reflected parallel beam illuminator(MRPBI) system, fabrication of 3D feed horn MEMS antennas plate using plastic [...]

Wafer and MEMS Processing

First-principles Study of Electron Transport through Atomistic Metal-Oxide-Semiconductor Structures

Zhang X., Fonseca L.R.C., Demkov A.A., Motorola, Inc., US

We describe a theoretical scheme to combine first-principles molecular dynamics simulation and non-perturbative scattering theory for transport calculations. We compare our approach with published results for electron transport through a single Al atom. The method [...]

Molecular Control of the Drain Current in a Buried Channel MOSFET

Yang J., de la Garza L., Thornton T.J., Kozicki M., Gust D., Arizona State University, US

We present results from a buried channel MOSFET with a molecular monolayer deposited on the surface. After attachment of the monolayer, the threshold voltage of the device shifts by approximately – 4.5 V. We explain [...]