Sensors, MEMS, Electronics – Page 238

Numerical Investigation of Phase-Changing Heat Transfer for Laser-Assisted Direct Nano Imprint Processing

Hsiao F-B, Wang D-B, Jen C-P, Lee Y-C, Chuang C-H, National Cheng Kung University, TW

Laser-Assisted Direct Imprinting (LADI), a novel and promising technique, has been proposed since 2002 to utilize an excimer laser to irradiate and heat the silicon surface through a highly-transparent quartz mold preloaded onto the silicon. [...]

Modeling of an Electroactive Polyimide Ultrasonic Wave Sensor for Aerospace Applications

Wilson W.C., Atkinson G.M., Perey D.F., Scott M.A., Tedjojuwono K.K., NASA LaRC, US

We have modeled a new, low cost polyimide Capacitive Micromachined Ultrasonic Transducer (CMUT) device constructed using a polyimide membrane. This paper presents the preliminary results of the electromechanical modeling of this new device. Polyimide was [...]

Extraction of Damping Coefficients of Comb Drive by Partitioning

Khaliq A., Liu X., Nohria R., Su Y., Varahramyan K., Louisiana Tech University, US

Accurate prediction of the dynamic behavior of comb-driven MEMS device is important to optimize the structure design. Viscous damping in the surrounding air determines the dynamic response of movable structures close to resonance. Viscose damping [...]

Symbolic Finite Element Analysis for Parametric Studies

Johnstone R.W., Shimizu T., Parameswaran M., Simon Fraser University, CA

In our paper, we will present a method of performing finite element analysis using a symbolic kernel. The representation of numbers used in analysis is symbolic expressions instead of floating point numbers. Unlike standard finite [...]

Electro-Static Membrane Model in CAD

Zubert M., Napieralska M., Napieralski A., Department of Microelectronic and Computer Science, PL

The model simplification is one of the most important problems in its design process. Every so often this approach tends to the physical phenomena violation, exceeding assumed domains or published models (and commercial software) application [...]

Effects of Etch Holes in Microelectromechanical Resonators

Yan J., Seshia A.A., University of Cambridge, UK

Micromachining processes such as surface machining of polysilicon microstructures or SOI-based processes often require etch holes to be created in the structural layer for purposes of releasing the mechanical structures. The present work examines the [...]

Computational Modeling of a Piezoelectrically Actuated Microvalve for the Control of Liquid Flowrate

Saeidi S.M., Khodadadi J.M., Johnson C.A., Lee C., Yang E.H., Auburn University, US

Computational modeling of liquid flow in a piezoelectrically actuated microvalve is discussed. A 3-D structured mesh with 330,000 hexahedral cells that represents the major features of the microvalve was generated for the numerical model. Due [...]

Three Degrees of Freedom Thermal Microactuator

Pasupuleti A., Sahin F., Walter W.W., Raisanen A., Hebding J.L., Hirschman K.D., Rochester Institute of Technology, US

This research is focused on the design and fabrication of a three-degrees-of-freedom (DOF) polyimide-based thermal microactuator. The proposed actuator can have displacements simultaneously in the X, Y and Z axes. The operation of the microactuator [...]

Computer Aided Design and Optimization of Integrated Circuits with RF MEMS Devices by an ANN Based Macro-Modeling Approach

Lee Y., Park Y., Niu F., Bachman B., Filipovic D., University of Colorado, US

Computer Aided Design of RF MEMS enables a reliable, cost effective and time saving alternative to the experiment guided development process. Full-wave analysis techniques including the finite element method and finite difference time domain have [...]

A Method for Solving Arbitrary MEMS Perforation Problems with Edge and Rare Gas Effects

Veijola T., Helsinki University of Technology, FI

We present an accurate and fast method solving arbitrary perforation problems utilizing a solver for an extended modified Reynolds equation, the Local Impedance Reynolds (LIR) solver. The extension includes an additional term in the Reynolds [...]