Sensors, MEMS, Electronics – Page 188

Au Nanoparticle Coupled- Surface Plasmon Resonance Chemical Sensor for Sensitivity Enhancement

Kim H-S, Kim J.H., Choi S-W, Kim H-S, Kim J.H., Cho Y-J, Choi S-W, Ajou University, KR

In order to overcome the sensitivity limitation of SPR, nanoparticle-coupled SPR biosensors have explored with tremendous interests since nanoparticles may significantly enhance the sensitivity by 1-2 orders of magnitude. M. J. Natan et al. reported [...]

Neural Network-Based MEMS Failure Probability Prediction

Ilumoka A.A., Tan H., UNIVERSITY OF HARTFORD, US

MicroElectronic and Mechanical Systems (MEMS) are a blend of microelectronic and mechanical devices closely coupled and simultaneously manufactured to monitor, analyze, and control everyday processes such as automobile function, biological systems operation and aeronautical flight. [...]

Silex offers sub 50 um pitch for through wafer connections in up to 600 um thick substrates

Bauer T., Silex Microsystems, SE

The silicon via process developed by Silex offers sub 50 um via pitch for through wafer connections in up to 600 um thick wafers. Silex via process enables MEMS designs with significantly reduced die size [...]

Angular Orientation-Specific Directed Self-assembly Enabling the Integration of Small Dies

Knuesel R.J., Bose S., Zheng W., Jacobs H.O., University of Minnesota, US

We report on recent progress in the directed self-assembly of discrete high performance semiconductor device components. Different from prior research, the goal is to enable the integration of ultra small dies (10-100 micrometer in size) [...]

Development of Materials and Sensors for the U.S. Army’s Active Coatings Technology Program

Zunino III J.L., U.S. Army ARDEC, US

The ability to custom build and integrate novel technologies into functionalized systems is the driving force towards the creation and advancement of active coatings systems. Active coating systems require the development and advancement of numerous [...]

Design and Characterization of new GaAs Micromechanical Thermal Converter developed for Microwave Power Sensor

Jakovenko J., Husak M., Lalinsky T., Czech Technical University in Prague, Faculty of Electrical Engineering, CZ

In this report we demonstrate the design of new GaAs based Micromechanical thermal converter (MTC) that creates heart of the RF power sensor microsystem. Transmitted power is the main quantity measured in RF systems. The [...]

Sensors & MEMS

Study of Thermal Efficiency Optimization in a Twin-bubble MEMS Micro-injector

Tang H-K, Tseng F-C, Wang W.W., Lee C-K, Lee I.Y., Lee K., Lee C-K, Lee I.Y., Lee K., Lee C-K, Lee I.Y., Lee K., BenQ Corporation, TW

In this paper, the methodology of design optimization to achieve optimal thermal efficiency of a twin bubble MEMS micro-injector is reported. This twin bubble back shooting structure can reduce the problems of crosstalk and satellite [...]

FEM Simulation for demolding process in thermal imprint lithography

Song Z., Lee J., Park S., Louisiana State University, US

Thermal imprint lithography is a highly potential technique utilizing molding to produce micro- and nano-structures with high throughput and at low cost. Extensive researches have been performed in understanding polymer flow behavior and cavity filling [...]

Genetic Algorithm for the Design of Microchip Flow Cytometers

Bang H., Lee W.G., Yun H., Min J.K., Chung C., Chang J.K., Han D-C, Seoul National University, KR

Robot designers and artificial-intelligence researchers have long been inspired by living things. Now, we are trying to mimic some of the most fundamental features of life while designing micro devices. In this paper we proved [...]