We report on recent progress in the directed self-assembly of discrete high performance semiconductor device components. Different from prior research, the goal is to enable the integration of ultra small dies (10-100 micrometer in size) while supporting unique angular orientation and contact pad registration. The process is based on the reduction of surface free energy between liquid solder coated areas on the substrate and metal-coated binding sites on the semiconductor dies. This paper will discuss the design of a fluidic platform to inspect the assembly process as it proceeds. Angular orientation control and discrimination between differently sized objects is accomplished using three dimensional docking sites that make use of raised pedestals and sequential batch transfer of differently sized components. Surface chemistry to prevent aggregation and agitation schemes will be presented that are key to the successful assembly of ultra small dies. The reported method aims at enabling integration and formation of interconnects to 10-100 micrometer sized chiplets closing the gap between nanoscopic and macroscopic systems, which is not possible using current robotic assembly and wire bonding concepts.
Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2007 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: May 20, 2007
Pages: 112 - 115
Industry sector: Sensors, MEMS, Electronics
Topics: Sensors - Chemical, Physical & Bio