TechConnect Briefs
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomePapers

Archives: Papers

TechConnect Proceedings Papers

Prediction Model of Microlens Fabricated by Modified LIGA Process

Kim D.S., Lee S-K, Lee S.S., Yang S.S., Kwon T.H., Lee S-K, Lee S.S., Pohang University of Science and Technology, KR
In this paper, we present a prediction model for microlens formation by means of a deep X-ray lithography followed by a thermal treatment of a PMMA (Polymethyl-methacrylate) sheet. According to this modeling, X-ray irradiation causes [...]

Simulation and Measurement of Dielectric Charging in Electrostatically Actuated Capacitive Microwave Switches

Reid J.R., US Air Force Research Laboratory, AFRL/SNHA, US
Simulations of the effects of dielectric charging on the operation of electrostatically actuated capacitive microwave switches have been performed. The simulations are unique in that they incorporate fixed charges into the calculation of the beam [...]

Design of the Two-Movable Plates Type MEMS Voltage Tunable Capacitor

Kim Y., Lee S-G, Park S., Kyungpook National University, KR
In this paper, we have proposed and designed the new structure of a RF-MEMS voltage tunable capacitor, which have two-movable parallel plates using electrostatic method and can be fabricated by the MEMS technology. Capacitance of [...]

Flow Cell Detection with an Optical Fiber

Kim E., Kim W., Kim E., Kim W., Lee S-G, Park S., Kyungpook National University, KR
In this experiment, we tested various optical fibers to select a suitable fiber for a effective flow cell detection. In order to align between micronozzle and optical fibers, a guide channel was fabricated by Si [...]

Comparative Studies of Novel Capacitive Transducers with Non-Planar Diaphragms

Chen J., Liu L., Li Z., Liu L., Tsinghua University, CN
Novel single-chip fabricated condenser structures with corrugated diaphragms for residual stress releasing have been proposed and simulated. An electrostatic-structural coupling FEM analysis has been performed to fully reveal the nonlinear relationship of output electrical signal [...]

Analysis of the Nonlinear Behavior of a MEMS Variable Capacitor

Innocent M., Wambacq P., Donnay S., Tilmans H., Engels M., DeMan H., Sansen W., IMEC, BE
Today’s wireless communication systems often require a high linearity for the RF building blocks. One of these blocks can be a tunable LC filter using MEMS variable capacitors (varicaps). In these filters, the varicaps are [...]

Snap-Through Bilayer Microbeam

Cabal A., Ross D.S., Eastman Kodak Company, US
In this paper, we describe our theoretical investigations of snap-through bilayer microbeams. We use a mathematical model that we devised to investigate the nonmonotone dependence of the vibrational frequency of such beams on temperature. The [...]

Simulation and Realization of Free Space Optical Switch Architecture Based on MEMS Vertical Mirrors

Wang W.J., Lin R.M., Nanyang Technological, SG
In this paper, we report on a novel optical cross-connect switch architecture based on MEMS vertical mirrors. The switch consists of a pair of MEMS mirror arrays to redirect optical beams from an input fiber [...]

Thermal Stability Evaluation of MEMS Microactuator for Hard Disk Drive

Jianqiang M., Shixin C., Yi L., Boon Buan L., Data Storage Institute, SG
Advances in hard disk drives have created a need for MEMS actuator to achieve high bandwidth of tracking servo and fine positioning of magnetic head. Thermal stability under operational conditions is one of the critical [...]

Development and Performance of a PVM Based Parallel Geometric Modeler for MEMS

Jorgensen C., Melander D., Schmidt R., Plimpton S., Sandia National Laboratories, US
This paper describes a successful approach to improving the robustness and speed of Sandia National Laboratory’s 3-D MEMS geometry modeler through a combination of mask subdivision and code parallelization. Symptoms of the robustness problems experienced [...]

Posts pagination

« 1 … 985 986 987 … 1,060 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.