Papers – Page 843 – TechConnect Briefs

Recent Advances in the Characterization of Free Volume in Model Fluids and Polymers: Shape and Connectivity

Willmore F.T., Sanchez I.C., University of Texas, US

The solubility and diffusivity of a penetrant species in an amorphous material are determined by the nanoscale properties of its free volume. Positron Annihilation Lifetime Spectroscopy, mechanical measurements of equation of state behavior, and Voronoi [...]

Microfabrication of 3D Structures Using Novel Thermoplastic Elastomers

Sudarsan A.P., Wang J., Ugaz V.M., Texas A&M University, US

We demonstrate the use of novel thermoplastic elastomers synthesized by dissolving readily available polystyrene–(polyethylene/ polybutylene)–polystyrene (SBS/SEBS) triblock copolymers (e.g., Kraton™ G series) in hydrocarbon oils for which the ethylene/butylene midblocks are selectively miscible. The insoluble [...]

Metal-oxide Nanowires for Toxic Gas Detection

Devineni D.P., Stormo S., Kempf W., Schenkel J., Behanan R., Lea S., Galipeau D.W., South Dakota State University, US

The objective of this work was to determine the feasibility of using EFEO to fabricate indium-oxide nanowires that could be used for sensing NO2 and O3. The effects of fabrication parameters such as indium film [...]

Fabrication of Silicon Nanowires Using Atomic Layer Deposition

Gopireddy D., Takoudis C.G., Gamota D., Zhang J., Brazis P.W., University of Illinois at Chicago, US

We will present the synthesis of silicon nanowires using Atomic Layer Deposition (ALD) technique. ALD allows the growth of nanowires in a controlled fashion using the nanoparticles as the seed. The diameter and the length [...]

Absolute Pressure Measurement using 3D-MEMS Technology

Russell R., Meriheinä U., VTI Technologies, US

The use of 3D-MEMS processes has created yet another new breakthrough. Extremely small silicon capacitive absolute pressure sensors can now be realized by utilizing the same MEMS technology that has been in production for many [...]

A Novel Method of Fabricating Optical Gratings Using the One Step DRIE Process on SOI Wafers

Cooper A.W., Docker P.T., Ward M.C., The University of Birmingham, UK

This paper describes a novel technique for manufacturing optical gratings by using the one step DRIE (Deep Reactive Ion Etching) process. Using the notching effect documented in previous work when working with silicon on insulator [...]

Microfabricated Silicon Apertures for Ion Channel Measurement

Wilk S.J., Goryll M., Petrossian L., Laws G.M., Goodnick S.M., Thornton T.J., Saraniti M., Tang J.M., Eisenberg R.S., Arizona State University, US

Ion channels are proteins that act as pores in cell membranes and allow only specific ions to pass through the cell wall. Here, we present a method for microfabrication of apertures in a silicon substrate [...]

Application of Magnetic Neutral Loop Discharge Plasma in Deep Quartz and Silicon Etching Process for MEMS/NEMS Devices Fabrication

Morikawa Y., Hayashi T., Suu K., Ishikawa M., ULVAC, Inc., JP

ULVAC’s Si deep etching technique has achieved high etching rate as high as 20 um/min as well as extremely high selectivity over resist mask as high as 100 or higher ensuring good etching performance.

Fabrication of Well-aligned and Mono-modal Germanium Dots on the Silicon Substrate with Trench-ridge Nano-structures

Chen P.S., Chen Y.J., Peng Y.H., Chen P.S., Chen Y.J., Kuan C.H., National Taiwan University, TW

Here we report the ability to fabricate well-aligned and mono-modal Ge dots on the silicon substrate with nano-trenches. It is started with electron beam lithography system (E-beam) to make patterns. Then reactive ion etching (RIE) [...]

Direct Wafer Polishing with 5 nm Diamond

Sung J.C-M, Tai M-F, Kinik Company, TW

CMP for making future semiconductor chips with nanom (nano meter) feature sizes can be accomplished by using nanom diamond particles embedded in an organic matrix (e.g. epoxy). Such nanom diamond particles are derived from the [...]