Papers – Page 596 – TechConnect Briefs

Modeling Voids in Silicon

Hasanuzzaman M., Haddara Y.M., Knights A.P., McMaster University, CA

Voids in silicon are used for gettering transition metals and may be used to detect point defect injection. High energy implants can create a separation between vacancies and interstitials making a vacancy rich region near [...]

Design for Manufacturing integrated with EDA Tools

Triltsch U., Büttgenbach S., Technical University of Braunschweig, DE

In this paper we present a process planning and optimization tool which can be linked to commercially available EDA tools. The increasing variety of available fabrication technologies and materials for microtechnological devices make the design [...]

Finite Element Analysis of a MEMS-Based High G Inertial Shock Sensor

Wang Y.P., Hsu R-Q., Wu C.W., National Chiao Tung University, TW

Inertial sensors have been extensively utilized in science and industry. For high G (>300G) applications, reaction times for conventional mechanical type shock sensors are not fast enough. In some cases the shock sensor structures disintegrate(>5000G). [...]

Numerical Modeling of Microdrop Motion on Digital Microfluidic Multiplexer

Ahmadi A., Najjaran H., Holzman J., Hoorfar M., University of British Columbia, CA

This paper introduces a computationally efficient numerical modeling approach for microdroplet motion on an innovative Digital Microfluidic Multiplexer structure which enables the pilot synthesis and study of nanoparticles. This structure offers an enhanced level of [...]

Design and Simulations of a Microfluidic Pump with Multiple Vibrating Membranes

Koombua K., Pidaparti R.M., Longest P.W., Atkinson G.M., Virginia Commonwealth University, US

A novel design of a micropump with multiple vibrating membranes has been developed in this study. The micropump consists of three nozzle/diffuser elements with vibrating membranes, which are used to create pressure difference in the [...]

The IMPRINT software: quantitative prediction of process parameters for successful nanoimprint lithography

Kehagias N., Reboud V., Sotomayor Torres C.M., Sirotkin V., Svintsov A., Zaitsev S., IMT RAS, RU

A homogeneous residual layer thickness in nanoimprint lithography (NIL) can be achieved by optimizing the NIL stamp geometry (the distribution of cavities and protrusions, the stamp cavities depth and the stamp thickness) as well as [...]

Process Sensitivity Analysis of a 0.25-um NMOS Transistor Using Two-Dimensional Simulations

Keshavarz A.A., Laurent L.F., Leonardi P.C., STMicroelectronics, US

This work attempts to predict the sensitivity of the 0.25-um NMOS transistor characteristics and parameters to selected manufacturing process steps. The transistor is on the 0.25um line of production in STMicroelectronics. The methdology uses two-dimensional [...]

The Immersed Surfaces Technology for Reliable and Fast Setup of Microfluidics Simulation Problems

Icardi M., Caviezel D., Lakehal D., ASCOMP GmbH, CH

ASCOMP has developed a new fully automatized version for microfluidics applications in bio-devices, using the IST (Immersed surfaces Technique) technique to map complex components/geometries into a simple rectangular Cartesian grid. Near wall regions are treated [...]

Structure Generation for the Numerical Simulation of Nano-Scaled MOSFETs

Kernstock C., Karner M., Baumgartner O., Gehring A., Holzer S., Kosina H., Global TCAD Solutions, AT

An accurate and predictive numerical simulation of MOS transistor in the deca-nanometer channel length regime relies on the precise mapping of the physical device into a simulation model. A quick and accurate method which allows [...]

First self-consistent thermal electron- phonon simulator

Vasileska D., Raleva K., Goodnick S.M., Arizona State University, US

We have developed the first self-consistent thermal electron-phonon simulator which solves the Boltzmann transport equation for the electrons and the energy balance equations for phonons, and as such allows us to make realistic estimates on [...]