TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeKeywordsmodeling

Keywords: modeling

Report on the Modeling of the Large MIS Cans

Moody E.W., Lyman J., Veirs D.K., Los Alamos National Laboratory, US
Changes in gas composition and gas pressure for closed systems containing plutonium dioxide and water are studied using a model that incorporates both radiolysis and chemical reactions. The model is used to investigate the behavior [...]

Modeling of Antipodal/BCSSS Transition for Millimeter Wave Finline High Q Local Injected Mixer

Sia E.K., Fu J.S., Lu C., Tan S.H., Nanyang Technological University, SG
Millimeter-wave application in intelligent vehicle sensor and others has been in great demand recently for it's small size, high data rate and high resolution property. In this paper, we report our design and simulation of [...]

Modeling of Deposition Process by Level Set Method

Jung H., Kwon O., Yoon S., Won T., Inha University, KR
In this paper, we report a novel method for effectively reducing the amount of calculation for a deposition rate at a specific level-set node. The proposed algorithm makes it possible to reduce the number of [...]

Finite Element Analysis in the Development of MEMS-based Compound Grating (MCG)

Yao Y., Castracane J., Xu B., Olson S., Eisden J.V., University at Albany-SUNY, US
This paper presents the development of the 1 mm ruled MEMS-based Compound Grating (MCG) in which the structural material of the rulings is SiO2 coated with Cr/Au as the top electrode. The MEMS simulation package [...]

Mixed-Dimensionality, Multi-Physics Simulation Tools for Design Analysis of Microfluidic Devices and Integrated Systems

Przekwas A.J., Makhijani V.B., CFD Research Corporation, US
Computational design of microfluidic devices and integrated microsystems involves several strongly coupled physical disciplines, including fluid mechanics, heat transfer, stress/deformation dynam-ics, electrokinetics, biochemistry and others. CFDRC is dev

A Method for Determining the Dependence of Integrated Circuit Performance on Silicon Process, Device and Circuit Parameters

Sipahi L.B., Myers B.A., Sanders T.J., Intersil Corporation, US
The goal of this project is to develop a structured methodology for achieving a design of a block of circuit in an IC which is more compliant to the specification using a multiple simulation approach. [...]

Multiscale Modeling of Microfluidics

Karniadakis G., Brown University, US
Micro-electro-mechanical systems involve complex functions governed by diverse transient physical and electrical processes for each of their many components. This is an example of a coupled-domain simulation, i.e., the simultaneous simulation of different functional units [...]

Modeling and Simulation of 3D Structures for Gigabit DRAM

Kwon O., Yoon S., Ban Y., Won T., Inha University, KR
In this paper, we present a 3D topography simulator, so-called 3D-SURFILER(SURface proFILER), to model a complicated 3D structure on the substrate for gigabit DRAMs. The 3D-SURFILER comprises a deposition and etching simulator employing a cell [...]

Micromirror Array Design and Simulation

Huja M., Husak M., Czech Technical University in Prague, CS
The main objective of the research described is to design optimal principle of micromirror array and its manufacturing technology with maximum penentration of the reflected/non-reflected part of micromirror array using standard, easily available and cheap [...]

Modeling and Simulation of a Permanent Magnet Array in Elliptical Configurations

Lee S.J., Jiles D.C., Iowa State University, US
Permanent magnet arrays have advantages for magnetic field generation over the traditional current based magnetic flux sources, such as electromagnets, in that they do not require a power supply and cooling system. Magnetic flux density [...]

Posts pagination

« 1 … 13 14 15 … 17 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.