microsystems – Page 2 – TechConnect Briefs

Realizing Complex Microsystems: A Deterministic Parallel Assembly Approach

Randall J., Hughes G., Geisberger A., Tsui K., Saini R., Ellis M., Skidmore G., Zyvex Corporation, US

The push towards miniaturization has created substantial interest in microelectromechanical systems (MEMS). To date, most of the developments regarding MEMS technology have relied on monolithic fabrication and integration. The monolithic approach has successfully produced various [...]

System Level Analysis for a Locomotive Inspection Robot with Integrated Microsystems

Jeong Y., Kim B., Oh H., Park J-O, Korea Institute of Science & Technology, KR

In this paper, we describe a locomotive inspection robot with integrated microsystems that comprises a micro pump, micro valves, micro channels, a sophisticated pressure amplification system with multi-bellows and biocompatible linear actuators with plastic coated [...]

Modelling and Simulation of Mechanical, Thermal and Electrical Behaviour of Si Cantilever with Implanted Strain Gauge

Husak M., Jakovenko J., Kulha P., Vborn Z., Czech Technical University in Prague, CZ

The paper describes methodology of design of cantilever with implanted layers in Si monocrystal. In the paper there is characterized physical model of implanted strain gauges, various girder topologies are designed and basic technological steps [...]

Microsystem Modeling – from Macromodels to Microsystem Design

Husak M., University of Prague, CZ

The paper presents ideas about possible approaches to development of microsystem models. From the general point of view, microsystem (MST) is considered as a system dealing with non-electrical quantities from all energy domains of real [...]

Concept of an Intelligent Microsystem Structure for Communication with Real Surrounding Space

Husak M., Jakovenko J., Czech Technical University, CZ

In the paper, concept of intelligent microsystem structure is presented. This concept is applicable in general surrounding environment. Concrete model of an intelligent temperature microsystem for control purposes is designed. Microsystem function has been verified [...]

Coupled-Energy-Domain Macromodeling of MEMS Devices

Casinovi G., Georgia Institute of Technology, US

This paper describes a systematic approach to the development of multi-energy-domain macromodels of MEMS devices. This approach is based on a particular form of the coupled algebraic-differential equations describing the dynamics of the device. All [...]

Integrated Modeling of Optical MEMS Subsystems

Stoll R., Plowman T., Winick D., Morris A., Coventor, US

This paper presents top-down holistic design and verification of a MEMS-based 3-D optical switching subsystem utilizing an integrated CAD environment. The subsystem design takes place in a nodal simulation environment that includes models for fibers, [...]

Micromirror Array Design and Simulation

Huja M., Husak M., Czech Technical University in Prague, CS

The main objective of the research described is to design optimal principle of micromirror array and its manufacturing technology with maximum penentration of the reflected/non-reflected part of micromirror array using standard, easily available and cheap [...]

A New Analytical Solution for Diaphragm Deflection and its Application to a Surface-Micromachined Pressure Sensor

Eaton W.P., Bitsie F., Smith J.H., Plummer D.W., Sandia National Laboratory, US

An analytical solution for large deflections of a clamped circular diaphragm with built-in stress is presented. The solution is directly applicable to micromachined pressure sensors. The solution is compared to finite element analysis results and [...]

Coupled Package-Device Modeling for MEMS

Bart S.F., Zhang S., Rabinovich V.L., Cunningham S., Microcosm Technologies, Inc., US

Microelectromechanical Systems (MEMS), by their nature as sensors and actuators, require application specific packaging. The package is the near environment of the MEMS device and hence has a direct effect on its thermal behavior, on [...]