microsystems – TechConnect Briefs

Nanotechnology-Enabled Microthrusters:Nanoenergetic Materials and MEMS Paradigm

Puchades I., Hobosyan M., Fuller L.F., Liu F., Thakur S., Martirosyan K.S., Lyshevski S.E., Rochester Institute of Technology, US

Microthrusters are used in flight and underwater platforms. The MEMS-technology microthrusters with nanostructured energetic composites increase thrust-to-weight ratio and ensure the overall requirements. The integrated MEMS micromachining ensures fabrication simplicity, affordability, robustness, integrability, compatibility and [...]

Gas Sensor with SAW Structures

Laposa A., Husak M., Kroutil J., Czech Technical University in Prague, Faculty of Electrical Engineering, CZ

The objective of this paper is presents the modeling and simulation of SAW (Surface Acoustic Wave) gas sensors based on one-port and two-port interdigitated metal structures. These sensors can be used for identifying environmental contaminants [...]

Control of MEMS-Technology Axial Topology MicroServos

Lyshevski S.E., Rochester Institute of Technology, US

Concurrent microsystems design, optimization, data-intensive analysis and hardware-software co-design of digital high-performance microelectromechanical systems (MEMS) have become major challenging themes. The major goal of this paper is to report-and-apply viable methodologies for design–and–implementation of MEMS [...]

Microsystems on their Way to Smart Systems

Heinze L., VDI/VDE Innovation + Technik GmbH, DE

This paper will deal with two core questions: 1. The evolution of Microsystems towards Smart Systems. 2. How will the development of Smart Systems influence the future of Microsystems Technologies (MST)? Overall from the development [...]

Micro to Nano – Scaling Packaging Technologies for Future Microsystems

Braun T., Becker K.-F., Bauer J., Hausel F., Pahl B., Wittler O., Mrossko R., Jung E., Ostmann A., Koch M., Bader V., Minge C., Aschenbrenner R., Reichl H., Technical University Berlin, DE

As the development of microelectronics is still driving towards further miniaturization new materials, processes and technologies are crucial for the realization of future cost effective microsystems and components. These future systems will not only consist [...]

MEMS and NEMS research for education

Husak M., Jakovenko J., Czech Technical University in Prague, CZ

The paper describes methods of active involvement of students in research work and application of research work results in educational process. Individual tasks are parts of solutions of large research projects. Individual work contributes to [...]

Global MEMS Equipment and Materials Markets and Opportunities

Sheet L., SEMI, US

The global MEMS market is experiencing strong growth, driven by consumer applications, MEMS-CMOS integration, automotive applications and emerging MEMS device markets. MEMS manufacturing technology and materials are critical to the continued growth in this market. [...]

Nano-structure or nano-system: opportunities and pitfalls

French P., Delft University of Technology, NL

Scaling down has revealed many new effects leading to new devices able to measure faster and more accurately than traditional devices. They also present challenges in terms of connecting to the macro-world and in reliability. [...]

Wireless Integrated MicroSystems (WIMS): Coming Revolution in the Gathering of Information

Wise K.D., University of Michigan, US

This paper discusses recent developments in microsystems, including progress in low power sensing, circuit integration, wireless interfaces, and wafer-level packaging. Increasingly, such systems are realized on two or three chips in stacked configurations or embedded [...]

Adhesive and Conductive – Inkjettable Nano-filled Inks for use in Microelectronics and Microsystems Technology

Meyer E.M., Meyer W., Arp A., Calderone F., Kolbe J., Meyer E.M., Meyer W., Schaefer H., Stuve M., Metalor Technologies SA, CH

The present work demonstrates feasibility of an inkjettable, isotropically electrically conductive adhesive in the form of a silver loaded resin with a 2-step curing mechanism. In the first step, the adhesive is dispensed (jetted) and [...]