TechConnect Briefs
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeAuthorsBucher M.

Authors: Bucher M.

Optimization of the device design technologies for optimum analog/RF performance of Nanoscale DG MOSFETs

Sharma R.K., Bucher M., Technical University of Crete, GR
Analog/RF performance of new device architecture: graded channel dual material double gate (GCDMDG) is investigated using ATLAS device simulator. A close comparison with double gate (DG), graded channel double gate (GCDG) and dual material double [...]

Bias Dependence of Low Frequency Noise in 90nm CMOS

Mavredakis N., Antonopoulos A., Bucher M., Technical University of Crete, GR
The bias dependence of low frequency noise (LFN) is investigated with measurements in 90nm CMOS. A recent charge-based LFN model combining carrier and mobility fluctuation components is compared to data from multi-finger devices with a [...]

Starting Over: gm/Id-Based MOSFET Modeling as a Basis for Modernized Analog Design Methodologies

Foty D., Binkley D., Bucher M., Gilgamesh Associates, US
A method of interpreting MOSFET behavior is described which is more coherent for modern analog CMOS circuit design. This method supercedes the use of simple but antiquated equations in design, and replaces them with an [...]

The EKV 3.0 Compact MOS Transistor Model: Accounting for Deep-Submicron Aspects

Bucher M., Enz C., Krummenacher F., Sallese J.M., Lallement C., Porret A.S., National Technical University of Athens, GR
The EKV 3.0 compact MOS transistor model for advanced IC design is presented. Its basis is an ideal analytical charge-based model including static to non-quasistatic dynamic aspects and noise. The ideal model is extended to [...]

The Foundations of the EKV MOS Transistor Charge-Based Model

Enz C., Bucher M., Porret A.S., Sallese J.M., Krummenacher F., Swiss Center for Electronics and Microtechnology, CH
This paper presents the foundations that lead to the EKV MOS transistor compact model. It describes all the basic concepts required to derive the large-signal and smallsignal charge-based model that is valid in all modes [...]

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.