TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeAffiliationsSynopsys, Inc.

Affiliations: Synopsys, Inc.

Si-Based Process Aware SPICE Models for Statistical Circuit Analysis

Krishnamurthy S., Dasarapu V.K., Mahotin Y., Ryles R., Roger F., Uppal S., Mukherjee P., Cuthbertson A., Lin X-W, Synopsys, Inc., US
This paper describes methodology for constructing compact SPICE models as a function of process parameter variations. The methodology involves global extraction of process-dependant SPICE model parametersfrom silicon data. The robustness of this methodology was tested [...]

An Improved Impact Ionization Model for SOI Circuit Simulation

Xi X., Li F., Liu W., Tudor B., Wang P., Wang W., Liu W., Lee F., Wang P., Wang W., Subba N., Goo J-S, Synopsys, Inc., US
The impact ionization (II) model accuracy issue in industry standard SOI MOSFET is discussed in the paper. Based on Medici 2D simulation study, an improved impact ionization model is proposed which can capture the voltage [...]

An Accurate and Versatile ED- and LD-MOS Model for High-Voltage CMOS IC Spice Simulation

Tudor B., Wang J.W., Hu B.P., Liu W., Lee F., Synopsys, Inc., US
The paper presents a high-voltage compact MOSFET model that has been proven physically accurate and numerically robust for various and generations of high-voltage ED (extended drain) and LD (laterally double diffused) production CMOS process technologies. [...]

Process Aware Hybrid SPICE Models using TCAD and Silicon Data

Mahotin Y., Tirumala S., Lin X., Pramanik D., Synopsys, Inc., US
This paper describes the methodology for extraction of process dependant hybrid SPICE compact model parameters using calibrated TCAD data and measured Silicon data. Process dependence of electrical curves is, initially, estimated using TCAD data set. [...]

TCAD-based Process Dependant HSPICE Model Parameter Extraction

Mahotin Y., Tirumala S., Lin X-W, Pramanik D., Synopsys, Inc., US
This paper describes the methodology for global extraction of HSPICE compact model parameters as explicit polynomial functions of process parameter variations (halo dosage, gate oxidation temperature etc). Electrical data required for extraction is obtained from [...]

An Optimization Method of Deep Submicron SOI Compact Model Parameter Extraction

Mahotin Y., Mickevicius R., Synopsys, Inc., US
As SOI rapidly advances to the vanguard of ULSI technology, compact model parameter extraction for SOI still relies on indirect methods. Floating body (FB) device parameter extraction is currently based on body contact (BC) devices. [...]

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.