Si-Based Process Aware SPICE Models for Statistical Circuit Analysis

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This paper describes methodology for constructing compact SPICE models as a function of process parameter variations. The methodology involves global extraction of process-dependant SPICE model parametersfrom silicon data. The robustness of this methodology was tested by the quality of fits to the silicon devices and data for process conditions not used in the extraction. The analysis demonstrates an excellent goodness of fit over the full range of process parameter variations. The process-dependant SPICE models allow direct access to process parameter variations in circuit design. The extracted models are employed in rudimentary digital circuits to investigate the delay variation in response to process deviations. The proposed approach significantly improves design-for-manufacturing (DFM) by allowing for accurate design sensitivity analysis and parametric yield assessment, as a function of statistically independent and measurable process variations.

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Journal: TechConnect Briefs
Volume: 3, Nanotechnology 2008: Microsystems, Photonics, Sensors, Fluidics, Modeling, and Simulation – Technical Proceedings of the 2008 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: June 1, 2008
Pages: 897 - 900
Industry sector: Sensors, MEMS, Electronics
Topic: Compact Modeling
ISBN: 978-1-4200-8505-1