Process Aware Hybrid SPICE Models using TCAD and Silicon Data

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This paper describes the methodology for extraction of process dependant hybrid SPICE compact model parameters using calibrated TCAD data and measured Silicon data. Process dependence of electrical curves is, initially, estimated using TCAD data set. The knowledge of process dependence is subsequently utilized to generate device electrical curves centered on typical measured Silicon data. These newly generated device electrical curves are used to extract hybrid SPICE model parameters as explicit functions of process parameter variations.

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Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2007 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: May 20, 2007
Pages: 684 - 686
Industry sector: Sensors, MEMS, Electronics
Topic: Compact Modeling
ISBN: 1-4200-6184-4