Papers:
Thermo-Mechanical Characterization and Integrity Checking of Packages and Movable-Structures
Szabo P., Perlaky G., Bognar Gy., Horvath Gy., Ress S., Poppe A., Rencz M., Courtois B., Budapest University of Technology and Economics, HU
The paper will present a variety of possibilities for the thermal characterization of different movable MEMS devices and packaging. It will discuss the major difficulties in these methodologies and the ways to overcome them. Comparison [...]
Application of MCLC Method for Estimating the Parameters of MEMS Sensors
An original method for estimating the parameters of MEMS sensors is presented. It is based on the measurement of binary oscillations appearing at the system's output when a discrete-time relay feedback is used: the parameters [...]
On the Determination of Thermal Expansion Coefficient of Thermal Oxide
Tsou C., Huang Y.S., Chang H.C., Department of Automatic Control Engineering, Feng Chia University, TW
The accurate value of thermal expansion coefficient (a) of thin film is an important thermal property in the design of microelectronic devices and microsystem. This research presents a microbridge buckling deformation caused by the residual [...]
The Modeling and Characterization of Nano-Scale MOSFET Resistance
Lee H.J., Lee J-H., Lee J-Y, Lee W.H., Lee H.J., Lee J-H., Lee J-Y, Lee W.H., Lee H.J., Lee J-H., Lee J-Y, Lee W.H., Kang E-S, Kang J-W, Lee H.J., Lee J-H., Lee J-Y, Lee W.H., Byun K.R., Kang E-S, Kang J-W, Hwang H-J., Kwon O-K., Sangmyung University, KR
It has been reported that both the shallow junction and the heavily doped extension as the methods to minimize the off-current and to stabilize the on-current of the sub-90nm scaled device, can solve the short-channel [...]
In-plane and Out-Of-Plane Mechanical Characterization of Thin Polysilicon
In this paper is presented the mechanical characterization of thin polysilicon using different test structures. There are described two classes of on-chip test structures, with movement respectively in a plane parallel to the substrate and [...]
Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: May 8, 2005
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9767985-2-2