In-plane and Out-Of-Plane Mechanical Characterization of Thin Polysilicon

, , , ,

Keywords: , , ,

In this paper is presented the mechanical characterization of thin polysilicon using different test structures. There are described two classes of on-chip test structures, with movement respectively in a plane parallel to the substrate and orthogonally to it. There are finally shown experimental results and the values obtained for Young’s modulus and for rupture stringht. In this last case the results were obtained using the Weibull statistic.

PDF of paper:

Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: May 8, 2005
Pages: 347 - 350
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9767985-2-2