Thermo-Mechanical Characterization and Integrity Checking of Packages and Movable-Structures

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The paper will present a variety of possibilities for the thermal characterization of different movable MEMS devices and packaging. It will discuss the major difficulties in these methodologies and the ways to overcome them. Comparison of the different measurement techniques of movable Micro Electro Mechanical System (MEMS) devices and packages will be discussed as well. We will also present a methodology for the checking of the integrity of various MEMS structures by thermal transient measurements, enabling testing and diagnosis of these structures.

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Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: May 8, 2005
Pages: 331 - 334
Industry sector: Sensors, MEMS, Electronics
Topics: Modeling & Simulation of Microsystems
ISBN: 0-9767985-2-2