MEMS & NEMS Devices, Modeling & Applications – Page 9

Temperature and Strain Coefficient of Velocity for Langasite SAW Devices

Wilson W.C., Atkinson G.M., NASA Langley Research Center, US

Surface Acoustic Wave sensors on Langasite substrates are being investigated for aerospace applications by NASA’s Vehicle Systems Safety Technologies (VSST) project. Strain sensors are being developed using the Langasite. Characterization of the Langasite material properties [...]

Non-contact biaxial nanoprobe utilized for surface measurements of MEMS

Goj B., Dressler L., Hoffmann M., Ilmenau University of Technology, DE

In this work an oscillating biaxial nanoprobe will be presented which measures the surface of a measurement object. The biaxial nanoprobe vibrates in two directions to realize scanning measurements and to overcome the challenges of [...]

Determination of different metals using new microsensors diamond doped with boron (BDD) in wastewater

Sbartai A., Namour P., Errachid A., Krejči J., Šejnohová R., Renaud L., Hamlaoui M-L., Loir A-S., Garrelie F., Donnet C., Soder H., Audouard E., Granier J., Jaffrezic-Renaul N., Universite de Lyon, FR

Different methods of analysis and speciation of heavy metals can be used alone or in combination, including the techniques of anodic stripping voltametry (DPASV) and the square wave (SWV). The Principe of these methods, there [...]

On the investigation of an interdigitated, high capacitance ratio shunt RF-MEMS switch for X- band applications

Angira M., BITS PILANI, IN

This paper presents a novel, highly compact capacitive shunt RF MEMS switch. In the presnted switch, interdigitation of signal lines with actuation electrodes. are used. The compactness has been achieved further by incorporating the HfO2 [...]

3-axis Capacitive Low-Gravity MEMS Accelerometer with Zero Cross-Axis Sensitivity in a Commercial Process

Merdassi A., Chodavarapu V.P., McGill University, CA

We describe integrated multi-axis low-g MEMS accelerometer devices fabricated in a commercial SOIMUMPS process available from MEMSCAP. We employ capacitive transduction mechanism which provides high reliability, low temperature sensitivity, low drift, and low power consumption. [...]

Micromachined Ultrasound Integrated Circuit

Hajati A., Latev D., Fujifilm Dimatix Inc, US

we present the design and experimental acoustic test data for an ultrasound transducer technology based on a combination of micromachined dome-shaped piezoelectric resonators arranged in a flexible architecture. Our high performance niobium-doped lead zirconate titanate [...]

Transient Analysis on Nonlinear Model of Electrostatically Actuated Nanomechanical Switch

Kim I.K., Han D.H., Lee S.I., University of Seoul, KR

This research predicted the transient behaviors of a nano-switch with static and dynamic analysis. The nano-switch consists of a cantilevered MWCNT incorporating the electrostatic forces and intermolecular attractive and repulsive forces between the CNT and [...]

A Novel Integrated Optomechanical Transducer and Its Application in Atomic Force Microscopy

Zou J., Miao H., Michels T., Aksyuk V., National Institute of Standards and Technology, US

Cavity optomechanics studies the coupling of optical and mechanical degrees of freedom in an optical cavity. It has made great progress in recent years and enabled quantum-limited measurement of mechanical motion. One important application is [...]

Film Bulk Acoustic Wave Resonator (FBAR) Filter for Ku-band Transceiver

Izza N., Nor M., Shah K., Singh J., Sauli Z., La Trobe University, AU

In this work, the optimisation and analysis of the Ku-band FBAR using 3-D finite element modelling (FEM) is presented. The estimation of material damping coefficients (α and β) using the Akhieser approximation is carried out [...]

Experimental study on sheet resistivity and thickness measurement in Copper Electroplating

Sharma A., Kumar D., Kumar Khandelwal S., Bansal D., Rangra K., Kumar D., Kumar Khandelwal S., Central Electronics Engineering Research Institute (CEERI/ CSIR), IN

Electroplated copper thin films have been extensively used for interconnections in semiconductor devices. In this paper, electroplating of copper has been investigated to study the dependency of plated film thickness, current efficiency and sheet resistivity [...]