We describe integrated multi-axis low-g MEMS accelerometer devices fabricated in a commercial SOIMUMPS process available from MEMSCAP. We employ capacitive transduction mechanism which provides high reliability, low temperature sensitivity, low drift, and low power consumption. We introduce a new technique to reduce or eliminate the cross-axis sensitivity based on the design of using both decoupled frames and different mechanical springs that are sensitive for each specific axis.
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2013: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational (Volume 2)
Published: May 12, 2013
Pages: 185 - 188
Industry sector: Sensors, MEMS, Electronics
Topics: MEMS & NEMS Devices, Modeling & Applications