Sensors, MEMS, Electronics – Page 99

u-Helix 3D-antenna technology

Nenzi P., Sapienza - Università di Roma, IT

A new technology for the integration of 3D antenna structure in packages will be presented. The integration of antennas on top of silicon chips or, in the same package is viable for frequencies above 40GHz [...]

Compliant interconnect technology for power modules in automotive applications

Nenzi P., University of Rome “La Sapienza”, IT

This work will present a new bond-less, economic viable, alternative to wire bonding technology for power dice interconnection in automotive applications. In the presented technology bond wires are replaced by compliant contacts embedded in a [...]

Effects of Ag and Pd Addition on Mechanical Property and Ion-migration Tolerance in Low Temperature Sintering Bonding Using Ag2O Paste

Hirose A., Itou T., Ogura T., Osaka University, JP

We have proposed a new bonding process using Ag2O paste composed of Ag2O particles mixed with reduction agent of triethylene glycol (TEG). Ag nanoparticles formed at around 130℃ to 160℃ through the reduction process. Such [...]

Investigation of Lead-free Nanosolder Reflow and Wettability Property for Electronics/Nanoelectronics Assembly and Packaging

Gao F., Gu Z., Shina S., Morose G., Eliason P., Farrell R., University of Massachusetts-Lowell, US

The current demand for high-performance interconnects in advanced packaging is resulting in dramatic scaling down of the electronics packaging feature size from microscale to nanoscale. Novel and/or enhanced interconnection and packaging techniques have to be [...]

Novel Nanofiber Anisotropic Conductive Films (ACFs) with coupled conductive particles for Ultra Fine Pitch Electronic Packaging Applications

Suk K-L, Paik K.W., KAIST, KR

In this study, a novel concept of nanofiber ACFs with conductive particles coupled in a nanofiber structure is suggested for ultra fine pitch applications. It was clearly demonstrated that novel nanofiber ACFs effectively suppressed the [...]

Advanced Packaging and Compound Semiconductors

Comb Finger Capacitive Micro Wind Senor

Zhao Z., Han Y., Du L., Fang Z., Wang X., Institute of Electronics,CAS, CN

This paper reports a novel micro wind sensor with comb finger shaped structure based on MEMS technology and capacitive sensing principle, which can measure wind speed and direction simultaneously. The proposed sensor was theoretically analyzed [...]

Calibrating the AFM with Self-Calibratable MEMS: A Theoretical Study

Li F., Clark J.V., Purdue University, US

To perform reliable scientific measurements with the atomic force microscope (AFM), it is important to calibrate the AFM cantilever. Conventional calibration methods have a 10 to 15% uncertainty, and the accuracies of such methods are [...]

Design and Characterization of a Fully Differential Mems Accelerometer Fabricated Using METALMUMPS Technology

Qu P., Oakland University, US

As an exploratory study, this paper presents a fully differential single-axis accelerometer fabricated using MetalMUMPS process. The unique common-centriod wiring of the metal electrodes enables a fully differential sensing scheme with robust metal sensing structures. [...]

Low-cost Thin-film Transistor-based Microcantilever for Measuring Deflection

Lin P-Y, Cheng Y-J, Kuan S., Huang L-S., National Tainwan University, TW

Here, we firstly report the low-cost poly-Si TFT embedded in the high-stress region of the microcantilever (MCL) as a sensing transducer to convert local strain into an electrical signal.In this work, the verification of reproducible [...]