TechConnect Proceedings Papers
Lumped Modeling of Thermal Inkjet Print Head
Lee Y-S, Kim M.S., Shin S., Shin S.J., Shin S., Shin S.J., CSE Center, Samsung Advanced Institute of Technology, KR
A lumped model is developed to improve the design of a thermally driven monolithic inkjet print head. The model is based on a two-dimensional heat conduction equation, an empirical pressure-temperature relation and a hydraulic flow-pressure [...]