A new algorithm has been developed for the layout based electro-thermal simulation of integrated circuits and MEMS, using simultaneous iteration. The general advantage of this method over simulator coupling is that, in contrast with the case of simulator coupling, very fast changes can also be considered. The usual drawback is however, that the thermal nodes have to be added to the nodes of the electrical network, rendering usually huge networks to be simulated. The novelties of our method are the modeling and the solution of the thermal structure that results in fastened calculations. The novelty of the modeling is that the thermal impedances are represented with the discretised thermal time-constant spectrum. The novelty of the solution algorithm is that in our method pre-computed solutions are used for the representation of the linear thermal sub-network, effectively reducing the number of thermal nodes that are participating in the iteration. This fastened algorithm works both in the time-, and in the frequency domain. The paper will shortly summarize the algorithm of the time constant spectrum based thermal modeling and the new algorithm of the electro-thermal co-simulation. In order to verify the correctness of the simulated electrical and thermal values, the simulated results will be compared with the measured results of a realised electro-thermal converter.
Journal: TechConnect Briefs
Volume: 2, Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 2
Published: February 23, 2003
Pages: 476 - 479
Industry sector: Sensors, MEMS, Electronics
Topics: MEMS & NEMS Devices, Modeling & Applications