SPICE model – TechConnect Briefs

Fabrication and modeling of resistance switching cells for ReRAM applications

Pawlikiewicz M., Kalkur T.S., University of Colorado Colorado Springs, US

This paper presents the technology, fabrication process, measurements and SPICE-compatible modeling of resistance switching devices. Those devices were built using nickel oxide (NiO) as for oxide layers between two platinum layers that were used as [...]

Characterization and Modeling of Metal Finger Capacitors

Lu N., Booth R., Daley D., Thompson E., Putnam C., IBM, US

A capacitor solution with no mask or process additions can be formed by the use of interdigitated metal fingers. Often, this metal finger capacitor uses multiple back-end-of-line (BEOL) levels to increase capacitance density. Metal structures [...]

Process Aware Hybrid SPICE Models using TCAD and Silicon Data

Mahotin Y., Tirumala S., Lin X., Pramanik D., Synopsys, Inc., US

This paper describes the methodology for extraction of process dependant hybrid SPICE compact model parameters using calibrated TCAD data and measured Silicon data. Process dependence of electrical curves is, initially, estimated using TCAD data set. [...]

Keywords: SPICE model

Fabrication and modeling of resistance switching cells for ReRAM applications

Characterization and Modeling of Metal Finger Capacitors

Process Aware Hybrid SPICE Models using TCAD and Silicon Data

Carbon Nanotube Transistor Compact Model

R3, an Accurate JFET and 3-Terminal Diffused Resistor Model

Modeling Snapback and Rise-time Effects in TLP Testing for ESD MOS Devices using BSIM3 and VBIC Models

R3, an Accurate JFET and 3-Terminal Diffused Resistor Model

Methodology for Model Generation with Accuracy from DC to RF