self-assembled – TechConnect Briefs

Wafer Level Assembly of Single-Walled Carbon Nanotube (SWCNT) Arrays with Precise Positioning

Cao J., Arun A., Lister K., Acquaviva D., Bhandari J., Ionescu A.M., Ecole Polytechnique Fédérale de Lausanne, CH

A novel wafer level assembly method to fabricate SWCNT arrays with precise positioning of each individual SWCNT by ac-dielectrophoresis (DEP) is presented. Unlike the previous CNT assembly performed directly between electrode pairs, in this work, [...]

Synthesis and characterization of polypyrrole nanowires using alternating amphiphilic copolymer nanotubes as templates

Chan A.S.W., Groves M., Malardier-Jugroot C., Royal Military College of Canada, CA

It has been reported that poly(styrene-alt-maleic anhydride) (SMA) chains would self-assembled into a nanotube in aqueous solution at pH7 by associating through a linear conformation which favours the association of the chains by decreasing the [...]

Reliability of Self-assembled Hydropobic Coatings: Chemical Resistance and Mechanical Durability

Kobrin B., Zhang T., Grimes M.T., Chong K., Nowak R., Chinn J., Applied Microstructures, US

We report on hydrophobic self-assembled monolayers (SAM) with an improved chemical and mechanical stability on both Al and Si substrates. These improvements are obtained using a relatively new molecular vapor deposition method - MVDTM, which [...]

Discontinuous Gold Films for Nanocell Memories

Nackashi D.P., Di Spigna N.H., Winick D.A., Amsinck C.J., Cheng L., Tour J.M., Franzon P.D., North Carolina State University, US

An important component to the nanocell, among other self-assembled networks, is the fabrication of a framework by which molecular elements can be interconnected. This framework must be nanometric in scale, created in a material suitable [...]

Integrated High Frequency RF Inductors with Nano/micro Patterned Ferromagnetic Cores

Zhuang Y., Vroubel M., Rejaei B., Burghartz J.N., Delft University of Technology, NL

Integration of magnetic material has been long proposed to potentially improve performance and shrink size of on-chip inductive RF/microwave components, e.g. inductors, transformers, and transmission lines, which is crucial for the development of cost-effective RF/BiCMOS [...]