Field-Based 3D Capacitance Modeling for sub-45-nm On-Chip Interconnect
Zhang A., Zhao W., Ye Y., He J., Chen A., Chan M., Beijing University of Aeronautics and Astronautics, CN
Considering both two-dimensional and three-dimensional single wire above plate, the proposed method decomposes the electric field into various regions and gives solutions for each part. The total ground capacitance is the summation of all components. [...]