3D simulation – TechConnect Briefs

The Impact of Dielectric Coatings and Porosity of Nanoparticles on Energy Density

Davis J., Brown D., Henderson W., Anbalagan P., Georgia Institute of Technology, US

Using experimentally calibrated 3-D quasi-electrostatic simulations, various microstructural architectures of cold-pressed nanoparticle (NP) compacts for low-frequency energy storage applications are investigated. This work is built upon our investigations into metal-insulator composites [1] and dielectric composites [...]

Three-dimensional Simulation method of Anisotropic Wet Chemical Etching Process

Lee J-G, Won T., Inha University, KR

Anisotropic wet chemical etching is still one of the fundamental techniques employed in silicon bulk micromaching. However, there are still unsolved problems with the simulation of the process. And most of the available simulation software [...]

Three-Dimensional Simulation of Polysilicon Thin Film Transistors with Single-, Double-, and Surrounding-Gate Structures

Li Y., Lee B-S, National Chiao Tung University, TW

Thin-film-transistors (TFTs) with high mobility and low leakage current are desirable in many applications especially in liquid crystal display (LCD).We have computationally analyzed electrical properties of thin film transistors using three-dimensional (3D) simulation. It is [...]

Effect of Fin Angle on Electrical Characteristics of Nanoscale Bulk FinFETs

Li Y., Chen W-H, National Chiao Tung University, TW

Bulk-finFET (fin-shaped field effect transistor) has been viewed as a good candidate for nanoscale VLSI device fabrication and nanoelectronic circuit design [1-5]. The structure features an excellent device characteristics compared with conventional planer structures. In [...]

Simulation of Orientation-Dependent Etching of Silicon Using a New Step Flow Model of 3D Structuring

Horn A., Schröder H., Obermeier E., Wachutka G., Münich University of Technology, DE

We present a new model of three-dimensional orientation-dependent etching of Si{100}. Recent experimental results suggest to conceive etching as a “peeling” process of terraced planes, leading to the concept of a “step flow model of [...]

High-Fidelity and Behavioral Simulation of Air Damping in MEMS

Turowski M., Chen Z., Prezekwas A., CFD Research Corporation, US

The paper presents simulations of air damping in MEMS, including squeeze-film and viscous dissipation, using different level models: 3D numerical solution of Navier-Stokes equations (using CFD-ACE from CFDRC), and circuit/behavioral model (in SPICE and Saber/MAST [...]