TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeAuthorsPark S-J

Authors: Park S-J

Development of a highly durable anode support for solid oxide fuel cell

Mehran M.T., Song R-H, Lim T-H, Lee J.W., Lee S.B., Lee J.W., Lee S.B., Park S-J, Korea Institute of Energy Research, KR
Solid oxide fuel cells are well known to be highly efficient and clean energy conversion devices for stationary and portable power generation. The ceramics based SOFC’s operate at high temperatures (>700 °C) and the durability [...]

Operation Characteristics of 1.3KW Class Anode-Supported Flat Tubular SOFC Stack

Lim T-H, Park J-L, Park S-J, Park J-L, Park S-J, Lee S.B., Song R-H, Shin D-R, Korea Institute of Energy Research, KR
KIER has fabricated anode-supported flat tubular SOFC stack for the intermediate temperature (700~800°C) operation. For this purpose, we have first fabricated anode-supported flat tubular cells by the optimization between the current collecting method and the [...]

Ceramic Microarrays for Aggressive Environments

Atre S.V., Wu C., Simmons K.L., Laddha S., Jain K., Lee S., Park S-J, German R.M., Oregon Nanoscience & Microtechnologies Institute, US
The effect of particle characteristics and polymer rheology on the fabrication of sintered ceramic microarrays using powder injection modling is examined. The impact of material composition on microfeature resolution and defect avoidance during processing was [...]

Densification and Grain Growth During the Sintering of Nanoscale SiC

Bothara M., Park S-J, German R.M., Sudarshan T.S., Radhakrishnan R., Atre S.V., Oregon Nanoscience & Microtechnologies Institute, US
Numerous routes have been developed recently for the synthesis of a broad range of ceramic and metal nanoparticles. However, applications for these new materials have lagged behind owing to a limited understanding of processing methods [...]

Simulating CMOS Circuits Containing Multiple FET Types Including the Geometric Dependence of Correlation between FET Types

Park J-E, Park S-J, Liang C-H, Assenmacher J., Watts J., Park J-E, Park S-J, Wachnik R., IBM, US
MOSFET device of similar design but different threshold voltage are often built on a single chip. It is important to be able to simulate with a compact model the variation of such devices including the [...]

Design & Fabrication of Ceramic Microarrays Using Powder Injection Molding

Atre S.V., Wu C., Park S-J, Simmons K., Oregon Nanoscience & Microtechnologies Institute, US
Microsystem technology has propelled the development of micro and multi-scale manufacturing techniques for more than a decade. Among these techniques, micro powder injection molding is drawing attention recently as one of the most cost-effective processes [...]

Effects of Zr Content on the Electrochemical Characteristics of Nano-Structure Controlled Ti-alloys

Oh M.Y., Choe H.C., Ko Y.M., Park S-J, Brantley W., Chosun University, KR
Objective: Pure Ti as well as Ti-6Al-4V alloy exhibit excellent properties for dental implant applications. However, for a better biocompatibility it seems important to avoid in the composition the presence of V due to the [...]

Mechanical Properties of Nano-Structure Controlled Ti-Hf Alloy for Dental Implant

Jeong Y.H., Choe H.C., Ko Y.M., Park S-J, Kim D.K., Brantley W., Chosun University, KR
Objectives: Cp-Ti has a excellent biocompatibility. So, it was widely used dental implants and artificial joint. But it is not strong enough for some dental applications. Since Hf belongs to the same group as Ti [...]

Surface modification of Cp-Titanium by Plasma polymerization of acrylic acid

Park H.J., Park S-J, Cho D.L., Park H.J., Park S-J, Ko Y.M., College of Dentistry, 2nd stage of brain korea 21, Chosun University, KR
Cp titanium sheet (15 mm x 15 mm) was used to two different surface treatments, including, etching with an HCl/H2SO4 solution and non-treated bare Ti sheet. To improve the adhesive strength of AA films, we [...]

Analysis of the Droplet Ejection for Piezoelectric-driven Industrial Inkjet Head

Sim S., Park C., Park S-J, Park C., Park S-J, Yoo Y., Kim Y., Joung J., Oh Y., Samsung Electro Mechanics Co., KR
A hybrid design tool combining one-dimensional(1D) lumped parameter model and three-dimensional(3D) computational fluid dynamics (CFD) approach has been developed and applied to industrial inkjet head design for the application of direct writing on printed circuit [...]

Posts pagination

1 2 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.