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HomeAffiliationsNational Tsing Hua University

Affiliations: National Tsing Hua University

10GHz Surface Acoustic Wave Filter Fabrication by UV Nano-Imprint

Chen H.J.H., Chen N.H., Chen H.J.H., Chen N.H., Lin C.H., Huang F.S., National Tsing Hua University, TW
Surface acoustic wave (SAW) devices have been widely implemented for wireless communications. Recently, SAW devices continue the upward trend in frequency for higher functionality. Nanoimpirnt can adequately offer mass production technique on interdigital transducer (IDT) [...]

Label-free and Real-Time Photonic Band-Gap Silica Nanosensor

Chyan J.Y., Yang S.C., Yeh J.A., National Tsing Hua University, TW
A photonic band-gap nanosensor based on porous silica is proposed in the study. The photonic band-gap silica nanosensor is easy to fabricate and simple to use. Its optical characteristics can be easily modulated by electrochemical [...]

The Study of the Nanocontact Imprint with Aminosilane

Shen F.Y., Chen J.H., Chen N.H., Lam K.Y., Chen J.H., Chen N.H., Huang F.S., National Tsing Hua University, TW
The purpose of this paper is to develop nano-contact imprint technology with simple process by using soft HSQ (hydrogen silsesquioxane) mold transfer aminosilane ink on HSQ and glass substrates with binding Glutraic dialdehyde (GA) and [...]

Investigation of dsDNA Molecule Mechanical Behavior using Atomistic Continuum Mechanics Method

Han C-N, Chou C.Y., Wu C-J, Chiang K.N., National Tsing Hua University, TW
In this research, an atomistic continuum model of dsDNA based on equivalent-spring method would be first conducted and the simulation result would be further validated by the experimental result. A spring element is chosen to [...]

A New Copper Electrodeposition Scheme to Reduce Void Defects after Chemical Mechanical Polishing

Lin J.Y., Wang Y.Y., Wan C.C., Wang Y.Y., National Tsing Hua University, TW
Deposition of highly (111) oriented conductive layer is required for achieving better electromigration resistance and lower resistivity. Moreover, the amount of void defects decreases as the (111)/(200) ratio increases in CMP process. Hence, we investigated [...]

Investigation of the Behaviors of Various Electroplated Copper films during CMP

Feng H.P., Cheng M.Y., Wang Y.Y., Wan C.C., Wang Y.Y., National Tsing Hua University, TW
The behaviors of various electroplated copper films during CMP are important for removal mechanism and defect generation. This article was to study the characteristics of various copper films during CMP, including impurity effect and current [...]

Investigation of Local-Strain Effect of the Nano-Scale Triple Gate Si/SiGe and SiN/Si Stacking MOS Transistor

Chang C.H., Chou C.Y., Peng C.T., Han C-N, Chiang K.N., National Tsing Hua University, TW
The tensile strained Si, based on the misfit between Si and SiGe gives higher speed and higher drive current for the metal oxide silicon field effect transistors. Based on the strained Si technology, a tri-gate [...]

Visible Light Emission from Si-related Nanostructures and the Effect of Ambient Atmosphere on Photoluminescence

Tsai M.-Y., Chi C.-C., Perng T.P., National Tsing Hua University, TW
Two different types of visible light emission were observed from the Si-related nanostructures prepared by vapor condensation in an Ar-5%O2 atmosphere at various working pressures (1, 30, 50, and 100 torr). The specimen prepared at [...]

A Highly Reliable Pattern Transfer of Hydrogen Silsequioxane

Liu J.F., Chen H.J.H., Chen S.Z., Chen H.J.H., Chen S.Z., Huang F.S., National Tsing Hua University, TW
In this paper, we focus on the effects of process parameters on pattern embossing into HSQ films, and the pattern degradation of HSQ for room temperature aging effects. The dilution of HSQ affects not only [...]

Au Nano-Wire Transferring onto HSQ by Nano Imprinting Technology

Liu J.F., Hsu Y.J., Chen J.H., Chen S.Z., Huang F.S., Chen J.H., Chen S.Z., National Tsing Hua University, TW
In this paper, we present the technique of transferring Au nano-wire on HSQ by using nano imprint. The Au nano-wires were fabricated by electroless-plating and investigated by TEM analysis. The stable nano imprinting and suitable [...]

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