US – Page 472 – TechConnect Briefs

Extraction of Compact Model Parameters for ULSI MOSFETs Using a Genetic Algorithm

Watts J., Bittner C., Heaberlin D., Hoffman J., IBM Microelectronics Division, US

Extracting an optimal set of parameter values for an FET device model is a complex problem. The final model must not only describe the performance of a set of hardware to an acceptable level of [...]

Simple ADPL Implementation of a 3D FEM Simulator for Mutual Capacitances of Arbitrarily Shaped Objects Like Interconnects

Hieke A., Siemens Microelectronics, US

This paper describes the implementation of an ANSYS Parametric Design Language (APDF) macro called CACACO for the computation of capacitance matrixes of arbitrarily shaped 3D objects in arbitrarily distributed dielectrics via the conservation of field [...]

A Wide Frequency Range Surface Integral Formulation for 3-D Inductance and Resistance Extraction

Wang J., Tausch J., White J.K., Massachusetts Institute of Technology, US

A new surface integral formulation and discretization approach for computing the magnetoquasistatic impedance of general conductors is described. The key advantage of the formulation is that it correctly predicts the resistance and inductance over the [...]

A Technique for Extraction of Macro-Models in System Level Simulation of Inertial Electro-Mechanical Micro-Systems

Zaman M.H., Bart S.F., Rabinovich V.L., Ghaddar C.K., Tchertkov I., Gilbert J.R., Microcosm Technologies, Inc., US

This paper presents a comprehensive CAD environment for MEMS/MST design. The design flow includes MEMS mechanical schematic entry, parameterized cell layout generation, LVS style error checking, lumped parameter macro-model generation, and system level modeling of [...]

Capacitance Extraction from Complex 3D Interconnect Structures

Cartwright D., Csanak G., George D., Walker R., Kuprat A., Dengi A., Grobman W., Los Alamos National Laboratory, US

A new tool has been developed for calculating the capacitance matrix for complex 3D interconnect structures involving multiple layers of irregularly shaped interconnect, imbedded in different dielectric materials. This method utilizes a new 3D adaptive [...]

Reduced-Order Modeling of Lorentz Force Actuation with Modal Basis Functions

Varghese M., Rabinovich V.L., Senturia S.D., Massachusetts Institute of Technology, US

We present a method for generating dynamic reduced-order models for Lorentz force actuation in microelectromechanical systems (MEMS). These models, derived from a set of meshed simulations, are analytical representations of the magnetic co-energy of a [...]

Accurate Inductance Extraction with Permeable Materials Using Qualocation

Massoud Y., Wang J., White J.K., Massachusetts Institute of Technology, US

In this paper we present a more accurate method for solving a frequency-dependent inductance of 3-D structures that contains permeable materials. The extracted inductance using the new method is much more accurate than when using [...]

MEMS Component Extraction

Baidya B., Gupta S.K., Mukherjee T., Carnegie Mellon University, US

Surface micromachined structures are composed of atomic elements like anchors, beams and fingers, which can be further grouped into components like springs, comb drives and plates. Automatic recognition of these elements and com-ponents is crucial [...]

Energy-Based Characterization of Microelectromechanical Systems (MEMS) and Component Modeling Using VHDL-AMS

Dewey A., Dussault H., Hanna J.P., Christen E., Fedder G.K., Romanowicz B.F., Maher M.A., Duke University, US

This paper presents an approach to defining and characterising component models that promotes the establishement of reusable intellectual property (IP) for microelectromechanical systems (MEMS), in particular, and composite microsystems, in general. System dynamic behavior is [...]

MEMS Functional Validation Using the Configuration Space Approach to Simulation and Analysis

Sacks E., Allen J., Purdue University, US

We have developed an interactive computer-aided design program that supports mechanical design of devices fabri-cated in surface micro-machining processes. The program automates kinematic analysis via a novel configuration space computation code, performs real-time simulation, and [...]