PL – Page 5 – TechConnect Briefs

VEGF-dependent mechanism of anti-angiogenic action of diamond nanoparticles in glioblastoma multiforme tumor

Grodzik M., Sawosz E., Wierzbicki M., Hotowy A., Prasek M., Jaworski S., Chwalibog A., Warsaw University of Life Sciences, PL

Inhibition of tumor angiogenesis suppresses tumor growth and prevents metastasis, and is a key target in cancer therapy. Novel materials, nanoparticles of carbon allotropes (C60 fullerenes, graphite nanoparticles, multi-walled carbon nanotubes, single-walled carbon nanotubes and [...]

Boundary Condition Independence of Cauer RC Ladder Compact Thermal Models

Janicki M., Torzewicz T., Kulesza Z., Napieralski A., Technical University of Lodz, PL

This paper presents a methodology to create compact thermal models of electronic systems. The models have a form of Cauer RC ladders and the values of their elements can be attributed physical significance. The methodology [...]

Novel Structure of CMOS Voltage-to-Current Converter for High-Voltage Applications

Jankowski M., Napieralski A., Technical University of Lodz, PL

The research presented in this paper is focused on combining voltage-based and current-based modes of high-voltage analog signal processing. The research originated from necessity of interfacing a large current-mode processing module inside voltage-mode integrated circuit. [...]

High-Voltage High Input Impedance Unity-Gain Voltage Buffer

Jankowski M., Napieralski A., Technical University of Lodz, PL

The research presented in this paper is targeted to devise possibly non-complex high-voltage unity-gain buffer well suited for connecting to outputs of current-mode stages. The circuit idea originated from need of buffering a high-voltage current-mode [...]

Design of ASIC Dedicated to Thermal Analysis of Many-Core Architectures

Szermer M., Kotynia L., Pietrzak P., Janicki M., Napieralski A., Technical University of Lodz, PL

The main goal of the paper is to present the design of an ASIC dedicated to thermal analysis of many-core architectures. Due to the fact that the process of designing real multi-core microprocessors is expensive [...]

Elastomer composites containing layered fillers and hydroxyapatities

Lipinska M., Pietrasik J., Zaborski M., Masek A., Institute of Polymer and Dye Technology, PL

Traditionally, as a filler of rubber carbon black is used. It is an active filler able to reinforce and improve the properties of finished rubber products. For ecological and economic reasons the research activity is [...]

The Application of RESCUER Software to Modelling of Coupled Problems in Modern Devices

Zubert M., Napieralski A., Technical University of Lodz, PL

The simulation of modern electronic devices requiring taking into account physical phenomena of different nature such as electrical, mechanical, thermal or fluidic ones. The most of processes are governed by multidimensional partial differentialalgebraic equations (PDAEs). [...]

Country: PL