Design of ASIC Dedicated to Thermal Analysis of Many-Core Architectures

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The main goal of the paper is to present the design of an ASIC dedicated to thermal analysis of many-core architectures. Due to the fact that the process of designing real multi-core microprocessors is expensive and time consuming, the authors decided to design a special test ASIC which will be used (together with a dedicated simulator) to estimate thermal dependencies between cores in many-core processors. The presented ASIC consists of 384 heat cells which represent the power dissipation sources in real many-core microprocessors. These heat cells create a 10×24 array. The presented ASIC is a part of a project aimed at defining the thermal coupling coefficients between cores in many-core architectures using a dedicated thermal-logic simulator. The proposed ASIC will be used for empirical verification of this method. The full paper will present in detail the architecture and the simulation results of this ASIC.

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Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2012: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational (Volume 2)
Published: June 18, 2012
Pages: 562 - 565
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topics: Informatics, Modeling & Simulation
ISBN: 978-1-4665-6275-2