Papers:
Off-Chip Printed Interconnects for Ultrathin Flexible Products
The relentless needs for increasing the functionality of microelectronic products while reducing their size and weight and having the advantages of thinness and flexibility call for novel technologies for the integration and assembly of multi-chip [...]
nanoCopper based solder-free electronic assembly material
The Advanced Technology Center of the Lockheed Martin Corporation developed a copper-based electrical interconnect material that can be processed at 200 °C, dispensed using 75 micron size syringe tips and has shown electrical & thermal [...]
A Novel Method to Maintain Alignment Accuracy in Bonding Process Utilizing Resin as an Adhesive Material
In this paper we have firstly reported that a novel method to maintain alignment accuracy in wafer bonding process utilizing resin as an adhesive material. We have proposed tentatively localized bonding method with 1100 nm [...]
Topology Optimization of Ultrasonic Transducers for Microsystem and IC Packaging
In this study, we introduce the method of topology optimization for piezoelectric transducers including ultrasonic tool horns for flip chip or wire bonding. Topology optimization performs an optimization with the objective function regardless of initial [...]
Low frequencies anomalies in GaAs FETs
The activation energy and capture cross section of the traps founds in GaAs field Effect transistors (GaAs FETS) have been measured both in ohmic and saturation region. A variety of transients found using frequency dispersion, [...]
High performance ZnO-based thin film transistor with high-κ gate dielectrics fabricated at low temperature
Han D.D., Cai J., Wang L.L., Wang W., Wang Y., Wang L.L., Wang W., Wang Y., Ren Y.C., Li S.J., Wang L.L., Wang W., Wang Y., Zhang S.D., Peking University, CN
We report on the fabrication and characteristics of low-driven-voltage and high mobility the thin film transistors (TFTs) using ZnO as an active channel layer grown by using radio frequency (rf) magnetron sputtering technique. The TFT [...]
Interfacial Studies of CrSi2/ HfO2 thin films as High k Metal Gate Dielectric layer on SiC devices
High k dielectric metal oxide films have attracted much attention as promising candidates in place of SiO2. The use of high –k/metal gate technology will provide cost, performance and power savings. To increase the capacitance [...]
Voltage Control Of A 3-Ø Self – Excited Induction Generators Using TSC (Thyristor Switched Capacitance)
An induction generator requires reactive power to set up and sustain magnetization and hence generates power. In grid connected induction generators this requirement is met by the grid, which unnecessarily burdens the grid and in [...]
Improved Commutation Control in Switching Regulators for Battery Equalizer Applications
This paper presents an easy accessible method for improvment of performance characteristics in some switching regulators topologies, inverters and others. Some strengths and weaknesses of synchronous switching are shown. The authors propose a solution for [...]
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2012: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational (Volume 2)
Published: June 18, 2012
Industry sector: Sensors, MEMS, Electronics
Topic: Energy Storage
ISBN: 978-1-4665-6275-2