The relentless needs for increasing the functionality of microelectronic products while reducing their size and weight and having the advantages of thinness and flexibility call for novel technologies for the integration and assembly of multi-chip products. Unlike transistor performance which benefits from reduced feature size, interconnects performance, suffers from increased resistance caused by reduced size. At Terepac, we propose a methodology for delivering miniaturized microelectronics by disintegrating the complex ICs connected using off-chip interconnects with nearly no performance penalty. Terepac technologies in releasing thinned dies and printing micron scale interconnects are the key to the chip miniaturization process which becomes a demanding feature for flexible and ubiquitous electronics. In this research work, we focus on our printing technology for the assembly of components for wearable biosensor patches. The components are released using Terepac patented Photoprinting Circuit Assembly(TM) on flexible substrates. The morphology, electrical conductivity, and mechanical stability of the interconnects are affected by the printing process parameters, and they have been characterized to make interconnects with desired conductivity and mechanical stability.
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2012: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational (Volume 2)
Published: June 18, 2012
Pages: 68 - 70
Industry sector: Sensors, MEMS, Electronics
Topics: Energy Storage