Papers – Page 3 – TechConnect Briefs

Preparation of charged droplets via electro-hydrodynamic spraying of polyelectrolyte solutions for the removal of floating particles with less than 10 um (PM10)

Lee K-I., Lee K., Lee K-I., Lee K., Kim S., Korea Electronics Technology Institute, KR

Ambient air quality tends to be worse due to the particle pollution in the region where the rapid commercialization is going on. Particulate matter (PM) describes fine inhalable particles with the specific diameter and smaller, [...]

Hot Carrier Effect and Oxide Reliability of T-FinFET Devices

He J., He X., He Y., Hu G., Li C., Liu J., He J., He X., He Y., Liu J., Ma G., He J., He X., He Y., Pan J., SoC Key Laboratory, Peking University Shenzhen Institute and PKU-HKUST Shenzhen-Hong Kong Institution, CN

Hot-carrier effect and oxide reliability of CMOS T-FinFET with 2.1nm-thick gate-SiO2 were investigated. It was found that hot-carrier immunity improves as the T-FinFET fin width (body thickness) decreases, which facilitates gate-length scaling, while it is [...]

An Effective Mobility Model for Tunneling Double-Gate MOSFET (T-FinFET)

He J., He X., Pan J., Liu J., Li C., Liu J., Hu G., Ma G., He J., He X., Chan M., SoC Key Laboratory, Peking University Shenzhen Institute and PKU-HKUST Shenzhen-Hong Kong Institution, CN

We have derived an analytical model for the effective field (Eeff) model of undoped Ultra-Thin Body (UTB) Double Gate (DG) SOI Tunneling MOSFETs ( T-FinFET) from the solution of the Poisson’s equation in this paper [...]

Analytical Modeling of Microfluidic Cantilever Sensor with Evaporating Ethanol

Marepalli L.K., Sukhotskiy V., K. Reddy I.V.A., Verma A., Furlani E.P., University at Buffalo, US

Resonating microcantilevers are widely used for myriad biochemical sensing applications. Small samples can be characterized for their physical [1], chemical [2], and thermal [3] properties. An example of such a sensor is shown in Fig. [...]

Display Compatible pMUT Device for Mid Air Ultrasound Gesture Recognition

Huang C.H., Demi L., Mao S., Jeong Y., Cheyns D., Rottenberg X., Rochus V., IMEC, BE

1. BACKGROUND Recently, piezoelectric micromachined ultrasound transducers (pMUT) have proved their potential to make a reliable 2D ultrasound array. As shown in Fig. 1, the displacement of piezoelectric material layer is galvanised by electrical signals/acoustic [...]

Numerical Simulation of Pulsed Electromagnetic Field Tissue Therapy

Sukhotskiy V., Marepalli L.K., Verma A., Fournier J., Gellman G., Bacon W., Furlani E.P., University at Buffalo, US

Applications of pulsed electromagnetic field (PEMF) therapy have grown steadily over the last 50 years, as clinical evidence of effectiveness for various treatments, e.g. pain relief, bone and tissue (wound) healing etc., has emerged [1]. [...]

Microsystems based sensor fusion enabling standalone navigation

Jalal M., University of Windsor, CA

There is a need for effective, standalone indoor navigation device which not only can track users in unknown environments but also assist their navigation by obstacle avoidance and path guidance. This research developed a state-of-the-art [...]

A novel co-resonantly coupled cantilever sensor platform

Koerner J., University of Utah, US

Dynamic cantilever sensors are used for many different applications, for example in material’s research to study magnetic properties of small particles and thin films, in biology for real-time observation of cell processes and as balances [...]

Silicon lens arrays for wafer level packaging of IR-sensors

Kulkarni A., Stenchly V., Quenzer J., Dudde R., Fraunhofer Institute Silicon Technology, DE

A new process technology has been developed for a cost efficient production of refractive convex lenses made of silicon. These lenses are produced as lens arrays on standard 8 inch silicon wafers to allow the [...]

Scoping Advanced Manufacturing: Implications for Occupational Safety and Health

Pomeroy-Carter C.A., Geraci C.L., Tinkle S.S., IDA, US

The term advanced manufacturing has been used to capture recent technology-enabled changes in manufacturing, incorporating elements such as “the use and coordination of information, automation, computation, software, sensing, and networking” and the “use of cutting [...]