Papers – Page 3 – TechConnect Briefs

Advanced Packaging for Next Generation Imaging and Sensor Devices

Kulick J., Indiana Integrated Circuits, LLC, US

Quilt Packaging is a unique and versatile edge-interconnect technology that utilizes “nodule” structures that extend out from the vertical facets along the edges of chips to allow for inter-chip communication. QP has demonstrated world-record chip-to-chip [...]

An Economical Lightweight Field Deployable PiezoElectric Gravimeter (PEG)

Jensen S., NASA, US

Conventional gravimeters typically measure the amount of the opposing forces required to suspend an object or by monitoring an objects freefall rate. The developed technology, a piezoelectric stimulus-response quantification based gravimeter (PEG), functions entirely different [...]

Embedded fiber optic sensors for battery performance monitoring in Lithium ion battery cells

Alemohammad H., Ghannoum A., Zdravkova L., Iyer K., Nieva P., Yu A., Khajepour A., Nieva P., Yu A., Khajepour A., University of Waterloo, CA

This paper is focused on the development of an embedded fiber optic sensor for monitoring the performance of Lithium ion battery (LIB) cells. The number of LIB cells are proliferating mainly due to the global [...]

Modeling the effect of the increase in the actuation voltage

Jamshidzade M., Cassles J., University of Barcelona, ES

In the past few years many reports have demonstrated the development of RF-MEMS switches considering the mechanical, electrical and chemical behaviors separately. However there are a few works which address the whole aspects of RF-MEMS [...]

Tip-Tilt-Piston Micromirror with Integrated Large Range Variable Focus for Smart Lighting Systems

Morrison J., Imboden M., Little T.D.C., Bishop D.J., Boston University, US

Modern fabrication techniques are enabling the adoption of micro-opto-electromechanical systems devices in applications never anticipated. Low-cost lighting systems can exploit micromirrors to both enable directed or sculpted light and to support short-range optical communications. The [...]

Towards generic platforms for MEMS manufacturing

Rouzaud A., Polizzi JP., Robert P., Arcamone J., CEA-LETI, FR

Coming at the time of technical maturity, MEMS industry requires now more standardization in manufacturing processes. This paper presents Leti’s contribution to develop generic platforms matching the suitable MEMS technologies within two distinct fields: physical [...]

MEMS pressure sensor with an AlGaN/GaN based high electron mobility transistor

Vanko G., Dzuba J., Rýger I., Vallo M., Institute of Electrical Engineering, SK

The III Nitrides (III-N), especially gallium nitride (GaN) and its compounds, are very attractive for pressure and strain sensing thanks to their excellent piezoelectric properties. The AlGaN/GaN heterostructure offers high mechanical and chemical stability, operation [...]

Effect of IMC thickness on thermo-mechanical reliability of lead-free solder joints in solar cell assembly

Zarmai M.T., Ekere N.N., Oduoza C.F., Amalu E.H., University of Wolverhampton, UK

The fatigue failure of lead-free SnAgCu solder joints in solar cell assembly is studied to determine the effect of thickness of intermetallic compound (IMC) layer on the reliability of the joints. Finite element modelling (FEM) [...]

Evaluation of Garofalo creep model for lead-free solder joints in surface mount components

Amalu E., University of Wolverhampton, UK

This investigation employs four hyperbolic sine creep constitutive models to simulate the deformation in Sn[3.0-4.0%]Ag[0.5-1.0%]Cu solder joints of two surface mount components assembled on printed circuit board. These creep models are proposed by Schubert et [...]

Simulation of Phonon Thermalization in a Single-photon Detector on the Basis of CeB6 Thermoelectric Sensor

Kuzanyan A.A., Kuzanyan V.R. Nikoghosyan A.S., Kuzanyan A.A., Kuzanyan V.R. Nikoghosyan A.S., Institute for Physical Research, Armenian Academy of Science, AM

Interest in single-photon detectors (SPD) has recently increased dramatically, due to many novel applications. The most developed SPD are currently based on superconductors. Following the theory, thermoelectric detectors (TSPS) can compete with superconducting detectors. The [...]