Papers – Page 8 – TechConnect Briefs

Molecular Wires and Logic Circuits Integration in a Single Molecule?

Joachim C., CEMES-CNRS, FR

Hybrid Molecular electronics (one molecule per device) do not offer good perspectives of miniaturization on the long term. The full integration, at the nanoscale, of a calculator will demand all the power of the quantum [...]

Nanomagnetic Materials: A review

Gupta T.K.S.P., Verma S.S., Sant Longowal Institute of Engineering and Technology, IN

Nanotechnology and nanostructured materials have the potential to significantly impact energy efficiency, storage, and production. Such applications can be used to monitor and remediate environmental problems, curb emissions from a wide range of sources, and [...]

Surface and Interface Characterization of Self-Assembled Copper Oxide Quantum Dots on SrTiO3(001) Surface

Thevuthasan S., Nachimuthu P., Kim Y.J., Lyubinetsky I., Lea A.S., Shutthanandan V., Engelhard M.H., Baer D.R., Shuh D.K., Lindle D.W., Pacific Northwest National laboratory, US

Interface controlled nucleation and growth of two and three dimensional nano structures show unique structural, optical, electronic and vibrational properties due to the quantum confinement of charge carriers. When the size is sufficiently small, the [...]

Nano-granular FePt-Ag Composite Films- Its Magnetic and Magnetotransport Properties

Zhang Z., Suzuki T., Kang K., Omoto N., Toyota Technological Institute, JP

Ordered FePt films have a very high magnetic anisotropy [1]. By annealing FePt/Ag multilayer precursor films, isolated FePt nano particles have been obtained with high perpendicular magnetic anisotropy, which opens a window for ultra-high-density magnetic [...]

In-situ Sintering Studies on Nano-Alumina

Stanciu L.A., Raether F., Groza J.R., Unviersity of California Davis, US

Recently, a thermooptical measuring device (TOM) has been developed to in-situ monitor the thermal diffusivity, shrinkage and light scattering of materials during sintering1,2. The initial stage of sintering is difficult to study by conventional methods [...]

Molecular Dynamics Simulations on Nanocomposites Formed by Intermetallic Dispersoids of B2 Structure and Aluminum Matrices

Namkung M., Paik S., Wincheski R.A., NASA Langley Rsearch Center, US

Molecular dynamics simulations were performed in order to characterize the local lattice structure in the vicinity of the interfaces between nanosized B2 intermetallic aluminide dispersoids and aluminum matrices. The dispersoid materials selected for the present [...]

Preparation of Monodispersed Silica and Composite Spheres

Tang F., Ding J., Chen D., Huang Z., Xia H., Meng X., The Chinese Academy of Sciences, CN

Nanoscale crystallites of metals or semiconductors, exhibiting unusual size-dependent electronic, magnetic, optical, and catalytic properties due to the onset of quantum effects, are being heralded as the next-generation building blocks for modern materials design. However, [...]

Surface Modification of Al203 Fiber with Nanoparticles Using a Dry Mechanical Coating Technique

Coowanitwong N., Wu C-Y, Nguyen J., Cai M., Ruthkosky M., Rogers J., Feng L., Watano S., Yoshida T., University of Florida, US

Nanoparticles are of great interest to many industries due to their unique properties. One of the well-known properties is high surface area, which is critically essential to enhancing performance activity [1] and greatly vital to [...]

Multivariant Measurements for Thin Film Adhesion as a Function of Temperature and Thin Film Thickness

Chiang M., Song R., Karim A., Amis E.J., National Institute of Standards and Technology, US

The progress of a proposed high-throughput combinatorial approach to the edge delamination test is reported. This approach can construct the adhesion reliability, as a function of temperature and film thickness (in the sub-micron range) in [...]

Chemically Functionalized Clay Epoxy Nanocomposites for Aerospace Applications

Balakrishnan S., Raghavan D., Howard University, US

Reinforcement of polymeric resin with nanoclay platelets has resulted in lightweight materials with enhanced mechanical and thermal properties. The selection of clay as reinforcing material is extremely appealing because of cost, high thermal inertness, and [...]