Multivariant Measurements for Thin Film Adhesion as a Function of Temperature and Thin Film Thickness

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The progress of a proposed high-throughput combinatorial approach to the edge delamination test is reported. This approach can construct the adhesion reliability, as a function of temperature and film thickness (in the sub-micron range) in one-step, for a thin film bonded to a substrate. Requirements for valid testing results from a mechanistic viewpoint are analyzed using three-dimensional computational fracture mechanics. A numerical evaluation using simulation has proven the feasibility of the combinatorial approach and to design the experimental protocol. An experimental evaluation has been in progress to fully demonstrate the combinatorial approach. Some preliminary experimental results indicate that the approach is very promising for assessing the adhesion reliability as a function of both temperature and film thickness in a single step. Temperature and film thickness are the parameters of greatest interest in industrial applications, but the test method can be extended to include other variables.

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Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 3
Published: February 23, 2003
Pages: 254 - 257
Industry sector: Advanced Materials & Manufacturing
Topics: Advanced Materials for Engineering Applications, Coatings, Surfaces & Membranes
ISBN: 0-9728422-2-5