Modeling Electrothermal Plastic Deformation

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Self-assembly of three-dimensional microstructures has been achieved using EPDA (Electrothermal Plastic Deformation Assembly). The EPDA process, in this case, is dependent on gold yielding within a gold and polysilicon bimorph. To plastically deform the bimorph it is heated such that the gold yields under compressive stress from actuation. When the bimorph cools the residual stresses within the plastically deformed gold pulls the bimorph into a new power-off position. New simulation results and measurements of the electrothermal plastic deformation process are presented for a gold and polysilicon bimorph. Plastic deformation is measured and shows the time dependent behavior. An implicit temperature dependent primary creep material model for gold is developed using the measured plastic deformation data to simulate the EPDA process. Finally, a complete device is simulated that compares well with measured results.

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Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 1
Published: February 23, 2003
Pages: 482 - 485
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9728422-0-9