Papers – Page 15 – TechConnect Briefs

Electric Field Induced Self Assembly of Polymer Structures

Yang M., Ozkan C.S., Gao H., University of California Riverside, US

We have developed a method for fabricating polymer microstructures based on electric field induced self assembly and pattern formation. A dielectric fluid placed in between to conductive plates experiences a force in an applied electric [...]

Diamond Replicas on Silicon Substrate

Martins D.R., Mansano R., Verdonck P., Salvadori M.C., University of Sao Paulo, BR

Most microelectromechanical system (MEMS) devices have been based on silicon. This is due to the technological know-how accumulated on the manipulation, machining and manufacturing of silicon. However, the silicon properties are poor, especially when compared [...]

Fabrication and Characterization of Cobalt Particles by Ion-beam Induced Chemical Vapor Deposition (IBICVD)

Lin K-W, Suzuki T., Kang K., Zhang Z., Toyota Technological Institute, JP

Nanometer-sized patterned media has been of great interest in high density data storage application [1,2]. Different fabrication techniques have been studied with its unique physical properties of nanoscale features. Among these, ion-beam induced chemical vapor [...]

Synthesis and Characterization of Spiral Carbon Nanofibers Containing Pd Metal Cluster by using Pd2(dba)3 as Catalyst

Su C-J, Hsu L-S, Wu T-W., Liu C-J, Lin S-H, Chung Shan Medical University, TW

The spiral carbon nanofibers consisting of Pd metal cluster were grown by the Pd2(dba)3-catalyzed decomposition of gaseous acetylene on molecular sieves (Linde 13X) support. The microstructure and composition of the spiral carbon nanofibers were characterized [...]

A Novel Simulation Methodology for Isotropic Gas Phase Etching

Bahreyni B., Shafai C., Card C.M., The University of Manitoba, CA

A novel methodology for the simulation of isotropic gas phase etching of a substrate is presented. In this method, individual substrate atoms are removed upon physical impingement of etchant gas molecules. The effects of different [...]

Alignment Characteristic and Mechanism of Carbon Nanotubes Synthesized by Hot Filament Chemical Vapor Deposition in a CH4/H2 Plasma

Yang Q., Chen W., Singh A., Xiao C., Hirose A., University of Saskatchewan, CA

Controlling of the alignment of carbon nanotubes (CNTs) is very important for applications such as scanning probes, sensors, field emitters and nanoelectronics. Controlled growth of CNTs aligned at different angles to the substrate has been [...]

Nanostructuring of Surfaces using Anodic Alumina Masks – Methods, materials and properties

Sawitowski T., Beyer N., Wagener S., Schulz F., AlCove Surfaces GmbH, DE

Since the discovery that cleanability is not necessarily linked to smoothness or gloss of surfaces it is interesting to take a closer look at methods allowing surfaces to be structured on a micrometer and nanometer [...]

Krylov-Subspace-Based Order Reduction Methods Applied to Generate Compact Thermo-Electric Models for MEMS

Bechtold T., Salimbahrami B., Rudnyi E.B., Lohmann B., Korvink J.G., IMTEK, University of Freiburg, DE

A high power dissipation density in todays miniature electronic/mechanical systems makes on-chip thermal management very important. In order to achieve quick to evaluate, yet accurate thermo-electric models, needed for the thermal management of microsystems, a [...]

A Fully Coulpled Computational Model of the Silylation Process

Winters W.S., Evans G.H., Prantil V.C., Larson R.S., Sandia National Laboratories, US

This paper describes a fully coupled computational model of the positive tone silylation process. The model is two-dimensional and transient and focuses on the part of the lithography process in which crosslinked and uncrosslinked resist [...]

Advanced Modelling Technique for Microscale Heat Transfer Analysis : Application to the flexible printed circuit microconnectors

Gatto V., Scudeller Y., Lottin O., l'Ecole Polytechnique de Nantes., FR

The paper presents an advanced modelling technique of 3D multi-scale heat conduction problem for the thermal analysis of microsystems and especially flexible printed circuit microconnectors (FPC). Nowadays, more and more applications in automotive and aerospace [...]