Papers – Page 10 – TechConnect Briefs

Thermal Behavior of a V-MCM Package Containing a Thermo-Pneumatic Micropump, Sensors and Integrated Electronics

Sieiro J., Morrissey A., Carmona M., Marco S., Samitier J., Alderman J., Universitat de Barcelona, ES

This paper descubes the thermal behaviour of vertical multichip module (V-MCM) devised within the BARMINT Esprit Project. It encloses an stack of elements including several ICs. a micromachined pump, and a multisensor chip provided with [...]

Electro-Thermo-Mechanical Simulations of Aluminum Bond Wires in IGBT-Packages

Hager C., Tronel Y., Fichtner W., ETH-EPFL, CH

Finite-element simulations have been performed on aluminum wires as used in modern IGBT (Insulated Gate Bipolar Transistor) power modules. These wires were ultrasonically bonded to thin molybdenum plates and the influence of different origins of [...]

Extraction of Dynamic HDL-A Models of Thermally Based Microsystems from Physical Simulations

Marco S., Carmona M., Samitier J., Universitat de Barcelona, ES

While analyzing the behaviour of complex systems it is not practical to carry out the simulation of the complete model a the physical level In order to move from simulations at tne physical level towards [...]

A Least Squares Algorithm for Optimal Heater Placement in Microsensors

Liu C.C., Man P.F., Mastrangelo C.H., University of Michigan, US

In this paper we present an algorithm that yields the optimal placement of a finite number of constant power density heaters for an arbitrary desired temperature profile. Using this algorithm, the volume efficiency (the percentage [...]

Elements for Modeling Diffused Piezoresistor Temperature Coefficient and Sensitivity

Mladenovic D., Hutchins J., Tran E., Lu S., Motorola, US

This article reviews elements needed to be considered in order to improve accuracy of the temperature coefficient and sensitivity (span) simulation for diffused piezoresistors. Modeling is done through an algorithm developed in 'Mathematica'. Input parameters [...]

Reduced Electro-Thermal Models for Integrated Circuits

Furmanczyk M., Napieralski A., Szaniawski K., Tylman W., Lara A., Technical University of Lodz, PL

Power dissipation density in today's integrated circuits makes thermal problems very important. Unfortunately, the electro-thennal co-simulations, which are often indispensable in solving thennal issues, are constrained by the lack of the IC's electro-thermal models. This [...]

Reliability Issues in Microelectromechanical Systems

Avula X.J.R., University of Missouri-Rolla, US

The interdisciplinary field of micro-electro-mechanical systems (MEMS) has emerged as a dominant field with potential for the development of commercially viable products such as sensors and actuators, automotive and aerospace electronics, computer peripherals, communication devices, [...]

Drain and Gate Voltage Influences on MAGFET Offset and Sensitivity: Modeling and Experiment

Ionescu A.M., Mathieu N., Chovet A., LPCS/ENSERG, FR

In this paper both offset and absolute/relative sensitivities of MAGFET (MAGnetic Field Effect Transistor) are investigated as functions of the drain and gate voltages. Accurate physical and analytical models are developed allowing the identification of [...]

Yield Prediction Under Non-Standard Data Distributions

Rao S., Saxena S., Apte P., Mozumder P.K., Davis J., Burch R., Vasanth K., Texas Instruments, Inc., US

The trend towards smaller feature sizes has increased the need to accurately characterize the distribution of process and device responses to predict and improve yield [1]. The usual approach to characterization assumes that the response [...]

A Floating Random-Walk Method for Efficient RC Extraction of Complex IC-Interconnect Structures

Iverson R.B., LeCoz Y.L., Random Logic Corporation, US

The floating random-walk method has been used to efficiently extract interconnect capacitance in complex, multilevel integrated circuits. We present here an overview of the floating random-walk method in the context of capacitance extraction. The method [...]