Power dissipation density in today’s integrated circuits makes thermal problems very important. Unfortunately, the electro-thennal co-simulations, which are often indispensable in solving thennal issues, are constrained by the lack of the IC’s electro-thermal models. This paper presents a complete development process of the Motorola MC33186 thennal model used for such simulations. The requirements for electro-thennal models, with the emphasis placed on the high computation speed, are discussed. Reduction of a 3D model based on the device’s physical structure is presented in details. Stress is laid on including in the final model elements typical for the devices’ application and crucial for the heat flow – in this case, the PCB. Another important aspect included in the paper is parameterization of the PCB properties.
Journal: TechConnect Briefs
Volume: Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems
Published: April 6, 1998
Pages: 139 - 144
Industry sector: Sensors, MEMS, Electronics
Topicss: MEMS & NEMS Devices, Modeling & Applications, Modeling & Simulation of Microsystems