Sensors, MEMS, Electronics – Page 128

Micro Crumples for Self-Assembly of Field Emission Devices

Sambandan S., Palo Alto Research Center, US

We study the electrostatic properties of crumpled conducting films, in particular the effective vertical electric field. The inspiration for this work is the possibility of self-organizing field emission devices with aims to reduce the cost [...]

Maskless Lithography Using Patterned Amorphous Silicon Layer Induced by Femtosecond Laser Irradiation

Kiani A., Venkatakrishnan K., Tan B., Ryerson University, CA

In this research, we reported a maskless lithography method by a combination of laser amorphization of silicon and wet alkaline etching. This technique can lead to a promising solution for maskless lithography because in comparison [...]

Influence of resist composition on demolding force in UV nanoimprint lithography

Amirsadeghi A., Lee J., Park S., Louisiana State University, US

We investigated the influence of the Young’s Modulus (E) of UV resist on the measured demolding force in UV-NIL by varying compositions of UV-curable polymers. We found that decreasing crosslinking content of the polymers decreases [...]

MEMS Fab: Design, Manufacture, Instrumentation

Networking in Micro/Nano Reliability Research Encouraged by EUCEMAN, the European Center for Micro- and Nanoreliability

Michel B., Hammacher J., Winkler T., Kaulfersch E., Fraunhofer ENAS, DE

Based on the conviction that advanced micro and nanotechnologies are continuing to have an ever stronger influence in all spheres of human life and will permeate them even more fully in the future, without, conversely, [...]

Advanced In- and Out-off plane High Resolution X-ray Strain Analysis on MEMS

Neels A., Dommann A., CSEM, CH

Related to the dramatically smaller volume of microelectromecanical systems (MEMS), new methods in testing and qualification are needed. In single crystal silicon (SCSi) based devices, stress and loading in operation introduces defects during the MEMS [...]

Influence of moisture on humidity sensitive material parameters of microelectonic relevant polymers

Walter H., Dermitzaki E., Wunderle B., Michel B., Fraunhofer IZM, DE

This paper presents various modified measurement methods for analysis the effect of moisture of thermo-mechanical properties of MEMS relevant polymer systems. It was developed an advanced measurement method, modified DMA multifrequency and hygroscopic swell analysis, [...]

A Multiscale Modeling Approach for Microelectronic Packaging Applications

Iwamoto N., Hölck O., Noijen S., Wunderle B., Todd S., Honeywell Specialty Materials, US

With increasing complexity of the systems and ongoing miniaturization, structural dimensions cross over from the micro- to the nanoscale. At this scale, conventional simulation methods are overtaxed: On the one hand, the continuum approach fails [...]

A Novel In-situ Force Measurement Method for Real Solder Joints Fatigue Evaluation

Roellig M., Metasch R., Meier K., Fraunhofer Institute for Non-Destructive Testing, DE

The paper presents a novel thermo-mechanical test method for in-situ force measurement on real solder joints during thermal cycling test. To generate more exact fatigue data for solder joints, a small mechanical machine has been [...]

In-situ MEMS Testing

Dommann A., Neels A., Schifferle A., Mazza E., CSEM, CH

In microsystems technology, new methods in testing and qualification are needed related to the dramatically smaller volume of microelectromecanical systems (MEMS). In single crystal silicon (SCSi) based devices, stress and loading in operation introduces defects [...]