Sensors, MEMS, Electronics – Page 127

High Fidelit Loud Microspeaker Based on PZT Bimorph Diaphragm

Choe Y., Chen S.J., Kim E.S., University of Southern California, US

This paper describes a microspeaker (composed of a 8mm square mechanically-polished PZT bimorph diaphragm and bulk-micromachined silicon top cover) that shows flat diaphragm displacement from DC to 11 kHz. A bimorph diaphragm is formed by [...]

Frequency-Interleaved MEMS Ultrasound Transducer

Chen S.J., Choe Y., Kim E.S., University of Southern California, US

This paper presents an ultra-sensitive, broad-bandwidth ultrasound transducer based on frequency interleaving of resonant transducers. A large number of cantilever-like diaphragm transducers with piezoelectric ZnO films have been optimally connected in series and parallel, so [...]

Modeling of a Surface Acoustic Wave Strain Sensor

Wilson W.C., Atkinson G.M., NASA Langley Research Center, US

NASA’s Integrated Vehicle Health Monitoring (IVHM) project is investigating new detection technologies that will increase aviation safety by monitoring the structural health of aerospace vehicles during flight. These new technologies must be rugged, light weight [...]

Carbon-based Nanoelectronic Devices for Space Applicatoins

Kaul A.B., Khan A.R., Megerian K.G., von Allmen P., Bagge L., Epp L., Baron R.L., Jet Propulsion Laboratory, US

The microelectronics industry based on Silicon (Si) continues to push the limits on scaling, which has created unique opportunities for nanoscale materials, such as carbon nanotubes (CNTs) and carbon nanofibers (CNFs). We will describe our [...]

Micromachined Glass-Blown 3-D Spherical Shells as Mechanical Vibratory Elements

Prikhodko I.P., Trusov A.A., Zotov S.A., Shkel A.M., University of California Irvine, US

This paper reports a non-contact experimental characterization of resonant modes in micromachined glass-blown spherical shells, enabling new architectures of vibratory 3-D MEMS for signal processing, timing, and inertial applications. Wafer-scale glassblowing was previously developed for [...]

MEMS & NEMS Devices

Machining Using Fast Tool Servo Combined with Ultrasonic Vibrator

Choi S.C., Hong Lu, Lee D.W., Pusan University, KR

In the diamond turning which conjunction with fast tool servo (FTS), burr formation is a key factor of the work piece surfaces roughness and diamond tool wear. This paper presents a machining method that combined [...]

Investigation on correlation between cold/hot weld line mechanical properties and micro injection molding processing parameters

Xie L., Zhu D., Ziegmann G., Steuernagel L., Technology University of Clausthal, DE

Micro injection molding has been attracting more and more market attentions, due to realizing the large scale cost effective production of Micro Electronic Mechanic System (MEMS) components. However, there are some defects which cannot be [...]

Practical issues with ion beam milling in acoustic resonator technologies

Mishin S., Oshmyansky Y., Bi F., Advanced Modular Systems, Inc, US

A practical approach to addressing production issues of thickness trimming was demonstrated through two-step trimming, send-ahead wafer, and deposition/trimming cluster tool. Thickness control necessary in SAW/BAW technology was demonstrated.

Monolithic CMOS MEMS technology development: A piezoresistive-sensors case study

Chaehoi A., Weiland D., O’Connell D., Bruckshaw S., Ray S., Begbie M., Institute for System Level Integration, UK

This paper presents the development of a monolithic CMOS-MEMS platform under the iDesign and SemeMEMS projects with the aim of jointly providing an open access “one-stop-shop” prototyping facility for integrated MEMS. This work addresses the [...]