Papers – Page 1059 – TechConnect Briefs

Three-Dimensional Simulation of Bulge Formation in Contact Hole Metalization

Pyka W., Selberherr S., Technical UniversityVienna, AT

During sputter deposition of metal layers bulges at sharp convex corners can arise and are observed after metalization of contact holes for semiconductor circuits. We present an explanation of this phenomenon by assuming that in [...]

Numerical Simulation for the Sacrificial Release of MEMS Square Diaphragms

Li W.J., Liu J., Shih J.C., Mai J.D., Ho C-M., Liu J., Tai Y-C., UC-Los Angeles, US

Chemical etching of sacrifeial layers is a widely used technique in surface micromachining Etch rate prediction of the sacrif cial layer in an etchant is critical for optimizing a giving fabrication process. This paper presents [...]

Modeling Image Formation in Layered Structures: Application to X-ray Lithography

Bollepalli S.B., Khan M., Cerrina F., UW-Madison, US

In the fabrication of semiconductor devices using lithography, the modeling of the exposure process is very often needed. The elements of a typical exposure system from a modeling perspective comprise of a radiation source, a [...]

A Method of MOSFET Dopant Profile Prediction and its Use in Transistor Design

Kulkarni M., Vasanath K., Davis J., Saxena S., Pollack G., Texas Instruments, Inc., US

As MOS transistor size shrinks to sub-quartermicron dimensions, accurate knowledge of the dopant concentration in various regions of the transistor is becoming more and more important for device simulations. We have developed a methodology to [...]

A Semi-Empirical Resist Dissolution Model for Sub-micron Lithographies

Khan M., Bollepalli S.B., Cerrina F., UW-Madison, US

In this paper, we present a new resist dissolution model suitable for large range of application domains - from memory devices employing < 130nm design rules to MEMS devices with design rules exceeding 10s of [...]

Computer Aided Mask-Layout for Bulk Etch Fabrication

Long M.K, Burdick J.W., Antonsson E.K., California Institute of Technology, US

This paper presents a method to synthesize the mask layout geometry for a MEMS wet etching process. Given a desired part geometry, the method determines a candidate mask geometry that will etch to the final [...]

Molecular Dynamics (MD) Simulations of Reactive Ion Etching (RIE) of Silicon by Cl, Cl2, Br and Br2 Cations

Valone S.M., Hanson D.E., Kress J.D., Los Alamos National Laboratory, US

Simulations of Cl plasma etch of Si surfaces with MD techniques agree reasonably well with the available experimental information on yields and surface morphologies. This information has been supplied to a Monte Carlo etch profile [...]

A Multi-disciplinary Design Flow for Designing Embedded System on Silicon

Bolsens I., IMEC, BE

Integrating systems on silicon implies more and more concurrent design by multidisciplinary teams that combine expertise in different technology disciplines. Future systems on silicon win consist of multi-processor architectures with high bandwidth embedded memory architectures [...]

Simulation and Modeling of Optoelectronic Devices, Circuits and Systems

Morikuni J.J., Mena P.V., Harton A.V., Wyatt K.W., Motorola, US

Holographic optical elements fabricated from DuPont's OMNIDEXô photopolymer have been demonstrated in a variety of product prototypes in which optical interconnect and semiconductor optoelectronic devices are integrated. With the emergence of Fibre Channel, Gigabit Ethernet, [...]

Micromanipulation and Robotic Technology

Fukuda T., Arai F., Univerisity of Nagoya, JP

Micromanipulation is needed for assembly and maintenance of micro machines and their parts. Micromanipulation is also important for bio-science and bio-engineering field. Yet, the design and control methodology for micromanipulation is not well established. In [...]